New Arrivals

Specialty Coating Systems PDS 2010 Parylene Coating System. pecialty Coating Systems portable parylene deposition system. Automatic operation, PLC control in auto mode the system pumps down to a preset pressure and the furnace cycles up to operating temperature. When proper temperature and pressure are established the vaporizer begins parylene sublimation. 12” dia. x 12” H stainless steel chamber. Substrate rotation plate. Liquid nitrogen trap with auto fill option. 120V, 60 Hz, 20A, CE.

Specialty Coating Systems PDS 2010 Parylene Coating System. Specialty Coating Systems portable parylene deposition system. Automatic operation, PLC control in auto mode the system pumps down to a preset pressure and the furnace cycles up to operating temperature. When proper temperature and pressure are established the vaporizer begins parylene sublimation. 12” dia. x 12” H stainless steel chamber. Substrate rotation plate. Liquid nitrogen trap. 120V, 60 Hz, 20A, CE

Steag (AG Associates) Heatpulse 610 RTP Rapid Thermal Processing System. Manually loaded and capable of processing silicon and III-V substrates up to 150mm in diameter, Heatpulse 610 provides solutions to your process development and monitoring needs. Benchtop system for rapid thermal processing of semiconductor wafers up to 6” dia. max. (Depends on wafer tray with system).

Performance Specifications

• Recommended Steady State Temperature Range: 400-1250° C.
• Steady-State Temperature Stability: ± 2° C.
• Temperature Monitoring Mechanisms: Extended Range Pyrometer (ERP), used throughout the recommended temperature range, or a thermocouple, used for process temperatures below 400° C.
• Heating Rate: 1-200° C per second, user-controllable.
• Cooling Rate: Temperature dependent; max 150° C per second.
• Maximum Non-uniformity:
• ±5°C across a 6″ (150mm) wafer at 1150°C. (This is a one sigma deviation 100 angstrom oxide.) For a titanium silicidation process, no more than 4% increase in non-uniformity during the first anneal at 650°C to 700 °C.
• Post-anneal sheet resistivity measured on a 150mm wafer annealed at 1100° C for 10 seconds. R&D models optimized for slip control.
• Implant: As 1E16 50 KeV with implant uniformity ≤0.3%

Steer LabPlus 20 Single Screw Extruder. Single screw laboratory extruder. Barrel Diameter 20. Screw Diameter 19.9 mm. Screw Minor Diameter11.3 mm. Screw functional length 28. Screw torque maximum 90 Nm. Barrel linear-moc Xaloy 8M 63/X200. Drive power 1.5kW. Maximum screw rotation 1415 rpm. Number of heating zones 3 zones plus Die adaptor plus Die head. Heating power 4.2kW. 230V, 3Ph, 60Hz

Semitool STI 870 Spin Rinser Dryer Double Stack. 6” Wafer Rotor in the top spinner and a 4" Rotor in the bottom spinner. High performance cleaning, rinsing and drying system for 25 wafer batch cassette. This system is capable of cleaning substrates from 2” to 6” round if the correct Rotor is installed for that wafer size. On axis orientation keeps wafers parallel allowing DI water manifolds to spray both sides of product continuously and simultaneously. Built in resistivity monitor. 120V, 50/60 Hz,

Semitool STI ST 260 Spin Rinser Dryer. High performance cleaning, rinsing and drying system for 25 wafer batch cassette. Currently configured with Rotor for 2” wafers. This system is capable of cleaning substrates from 2” to 5” round if the correct Rotor is installed for that wafer size. On axis orientation keeps wafers parallel allowing DI water manifolds to spray both sides of product continuously and simultaneously. Built in resistivity monitor. 120V, 50/60 Hz,

Temescal Ferrotec FC-2000 Ebeam Evaporator with Ion Gun Etch. The FC-2000 is a fast- cycle, load-locked system that allows the source to remain under vacuum during substrate reloading. The system is configured with a 6 pocket electron gun with a supersweep 64 sweep controller and the CV-6SLX 6KW E-gun power supply. The system also has a single resistive thermal deposition source. There is a 3-cm Ion source for etch or assisted deposition. Also includes the Inficon XTC/3S crystal deposition controller with dual crystal holder. System has a lift off dome for 4" wafers and variable speed substrate rotation.Standard source-to-substrate distance: 19.5″. The bell jar is 20" diameter. The Temescal Control System (TCS) provides fully integrated, recipe-driven process and vacuum control. Operating in any of three password-protected modes, the TCS also offers process variable monitoring, process and historical trend tracking, and process data logging. The TCS Automatic Mode. Auto mode operation provides fully automated execution of user-programmed recipes consisting of up to twenty process steps, as well as full abort diagnostics. The TCS Auto Mode also offers independent autopump and autovent operations, automated cryopump regeneration, and automated rate-of-rise testing. Manual Mode Operation. The TCS manual mode enables the user to set process parameters, operate major components and subsystems individually with full interlock protection, and execute nonautomated single-film deposition processes. Service Mode Operation. The TCS service mode provides noninterlocked low-level control over any of the system’s valves, pumps, motors, or power supplies. System Power 208V, 3Ph, 60Hz

Tenney BTRC Temperature and Humidity Test Chamber. Environmental temperature humidity system. Color LDC screen controller with real time graphic displays. RS232 data communications. Temperature Range: -70°C to +200°C. Humidity range 20% to 98% rh. Non CFC refrigerants. Inside Dimensions: 20” L x 19.5” W x 22” H. 1-inch and 2-inch cable ports on side. 240V, 1 Ph, 60 Hz, 23A

Tenney BTRC Benchtop Temperature Humidity Test Chamber. Digital programmable controller. Temperature Range: -68°C to +200°C. Humidity Range: 20% to 95% rh. Inside Dimensions: 20” L x 19” W x 22” H.  2” cable port. 240V, 1 Ph, 60 Hz, 23A

Tenney BTRC Benchtop Temperature Humidity Test Chamber. Digital programmable controller. Temperature Range: -68°C to +200°C. Humidity Range: 20% to 95% rh. Inside Dimensions: 20” L x 19” W x 22” H. 2” cable port. 230V, 1 Ph, 60 Hz, 30A