Sputtering Systems

Target Area: 29-1/2 in. x 4-7/8 in. Gas input. With cart for maintenance of cathode.

Magnetron cathode for sputtering over a large area. Target Size: 29-1/2 in. x 4-7/8 in.

THIS UNIT IS SOLD. WE WOULD LIKE TO BUY YOUR ANATECH SYSTEMS. PLEASE CONTACT US IF YOU HAVE SYSTEMS TO SELL. * * * * * * * * * * * * * * * * * * * * * * * * * * Cold Deposition/Etch Sputter Coater for SEM Sample Preparation. Does not have thickness monitoring crystal. Magnetically enhanced sputter head minimizes sample heating. Etch and plasma mode for removal of organic surface contamination. Automatic slow venting at termination of process. Built-in pump. Sample stage accommodates up to 3 in. dia. substrate or 12 SEM stubs. Does not come with gold target. 115V, 60 Hz, 4A.

Five Target RF and DC Magnetron In Line Sputtering System. Currently configured for single sided sputtering but cathodes can be moved manually if double sided sputtering is desired. Target Size: 3-1/2 in. x 18 in. Easy access to cathodes via hinged doors. Currently configured with 4 DC and 1 RF cathodes. Multiple CTI cryopumps for high vacuum. Load lock chambers on both ends. Loader handles up to 28 20 in. H panels or pallets. Variable speed pallet transport system. Tested: $119,000. As Is Untested: $69,000.

Sputtering System. The Auto 500 box chamber system is a versatile front loading thin film system for Research & Development or preproduction.  The chamber is mounted on a pedestal, housing the pumping stack. A rack panel next to the vacuum pedestal houses controls for vacuum and all thin film processes accessories. Three RF magnetron cathodes, two are 4 in. dia. and one is 3 in. dia.  Rotating Substrate Carrier: 11 in. dia.  Includes RF etch.  Crystal film thickness monitor.  Turbo pump with controller and roughing pump.

DC Sputtering System. Chamber: 12 in. dia. x 18 in. H glass Pyrex bell jar with guard. 15-inch dia. baseplate/pumping plenum assembly supported by system cabinet. System mounted on casters. Pumping System: Turbomolecular pump, LN2 trap located beneath high vacuum poppet valve and manual fill via external funnel. Alcatel 2010 two stage, rotary vane pump. Sputter Source: (1) DSM-300A cold sputter module. 300W DC power supply, 4-inch dia. magnetron sputter source with Denton Vacuum patented ANODE GRID® for maximum electron capture and minimal specimen heating. Variable source to substrate distance. Substrate Fixturing: 8.0 in. Omni rotating fixture plate, speed adjusts via input to system touch screen. Air operated shutter. Control System: The Explorer 14 system is semiautomatic and is controlled by a DL205 CPU from Automationdirect. The operator interface is a touch panel with graphical interface to the PLC. Graphical interface is supported with Automationdirect software. Manual operation of valves, pumps, low voltage sources and fixture rotation subsystems is through this graphical interface. Semiautomatic processes are also operated through this interface.

Cold Deposition/Etch Sputter Coater. Simple automatic operation. Extra large chamber: 8 in. dia. x 8 in. H. Ring type cathode 4 in. dia. (gold not included). 6 in. dia. specimen stage for multiple specimens. Self contained vacuum system.

Cool Sputter Coater for SEM Samples. Easy to use full instrumentation. Adjustable target to work table distance. No gold target with system. Built in vacuum pump. 110V, 60 Hz, 8A.

Benchtop Vacuum Coater for TEM/SEM Sputter Coater and Carbon Coater. Currently configured sputtering source (ring type) and carbon coating source. E5350 power supply. 12 in. x 12in. bell jar with implosion guard. 110V, 60 Hz.

Six Target Load Locked RF DC Sputtering System. Dual chamber with load lock. Three cathodes in each chamber for total of six cathodes. PLC Process control (programmable depositions). Substrates up to 8 in. dia. Substrate rotation. Substrate bias, RF and DC. Substrate heater up to 500 deg C. 3-inch Magnetron sputter cathodes. Process Gases: Ar, O2, N2. RF and DC power supplies. CALL FOR PRICE.