Sputtering Systems

THIS UNIT IS SOLD. WE WOULD LIKE TO BUY YOUR ANATECH SYSTEMS. PLEASE CONTACT US IF YOU HAVE SYSTEMS TO SELL. * * * * * * * * * * * * * * * * * * * * * * * * * * Cold Deposition/Etch Sputter Coater for SEM Sample Preparation. Does not have thickness monitoring crystal. Magnetically enhanced sputter head minimizes sample heating. Etch and plasma mode for removal of organic surface contamination. Automatic slow venting at termination of process. Built-in pump. Sample stage accommodates up to 3 in. dia. substrate or 12 SEM stubs. Does not come with gold target. 115V, 60 Hz, 4A.

Five Target RF and DC Magnetron In Line Sputtering System. Currently configured for single sided sputtering but cathodes can be moved manually if double sided sputtering is desired. Target Size: 3-1/2 in. x 18 in. Easy access to cathodes via hinged doors. Currently configured with 4 DC and 1 RF cathodes. Multiple CTI cryopumps for high vacuum. Load lock chambers on both ends. Loader handles up to 28 20 in. H panels or pallets. Variable speed pallet transport system. Tested: $119,000. As Is Untested: $69,000.

THIS UNIT IS SOLD. WE WOULD LIKE TO BUY YOUR DENTON VACUUM SYSTEMS. PLEASE CONTACT US IF YOU HAVE SYSTEMS TO SELL. * * * * * * * * * * * * * * * * * * * * * * * * * * Cold Sputter and Etch System for Coating SEM Samples. Self contained cool sputter coater. Automatic or manual operation. Magnetron sputterhead. 6 in. dia. pyrex chamber. Sputtering and etch modes. Uses foil targets that can be changed in minutes (no target with unit). 120V, 60 Hz.

DC Sputtering System. Chamber: 12 in. dia. x 18 in. H glass Pyrex bell jar with guard. 15-inch dia. baseplate/pumping plenum assembly supported by system cabinet. System mounted on casters. Pumping System: Turbomolecular pump, LN2 trap located beneath high vacuum poppet valve and manual fill via external funnel. Alcatel 2010 two stage, rotary vane pump. Sputter Source: (1) DSM-300A cold sputter module. 300W DC power supply, 4-inch dia. magnetron sputter source with Denton Vacuum patented ANODE GRID® for maximum electron capture and minimal specimen heating. Variable source to substrate distance. Substrate Fixturing: 8.0 in. Omni rotating fixture plate, speed adjusts via input to system touch screen. Air operated shutter. Control System: The Explorer 14 system is semiautomatic and is controlled by a DL205 CPU from Automationdirect. The operator interface is a touch panel with graphical interface to the PLC. Graphical interface is supported with Automationdirect software. Manual operation of valves, pumps, low voltage sources and fixture rotation subsystems is through this graphical interface. Semiautomatic processes are also operated through this interface.

Four Target RF DC Sputtering System with Loadlock. Versatile high vacuum R&D and pilot production thin film magnetron sputtering system. Graphical user interface displays all features and system functions. Currently configured with four RF/DC stack mount 3 in. dia. magnetron sputter cathodes. Cathodes can be moved so gap between target and substrate can be variable. Unit comes with adapter plates so that two of the cathodes can be mounted on an angle for confocal sputtering. All four currently mounted straight down. Load lock and main chamber are turbo pumped and chamber turbo has recently been replaced. Variable speed rotating substrate holder with RF bias control. Two gas inputs controlled via MFC, AR, O2. Quartz substrate heaters in chamber for heat up to 150 deg C. RF and DC magnetron power supplies. Previously sputtered Si, Si, SiO2, Si. System Mfg. Date: 12/2008.

Sputter Coater for SEM Samples. Provides a uniform, conductive, fine grained coating. Self-contained unit with built-in pump. Advanced design magnetron sputterhead for truly cold sputtering. Etch mode for sample cleaning. 6 in. OD pyrex chamber. Sputters precious metals, no target included. Does not require gas. 120V, 50/60 Hz, 10A.

Sputter Coater. Cold sputter and etch system for coating SEM samples. Self-contained cool sputter coater. Automatic or manual operation. Magnetron sputter head. Pyrex Chamber: 6 in. dia. Sputtering and etch modes. 120V, 60 Hz.

Auto Turbo High Vacuum  DC Sputtering System. Laboratory or light production thin film DC sputtering system with graphic user interface and touch screen control. Manual or automatic operation of valves, pumps, low voltage sources, and fixture rotation subsystems is through this graphical interface. Deposition Chamber: 14 in. H x 14 in. W x 14 in. D stainless construction. Turbo pump with roughing pump. (1) Micrometer gas-bleed valve to introduce process gas into the deposition chamber. (1) Gas isolation (toggle) valve for process gas control. Sputter Source: (2) 3.0 in. dia., Denton Vacuum, internal stalk-mount, planar magnetron sputter sources: I. RF/DC capability, only DC installed. II. Variable source to substrate distance. III. Clamp/bond target compatibility. (2) Independent, electro-pneumatic source shutters (cylinder mounted air flowrate control) interfaced to system PLC for remote open/close operation. Sputter Power Supply: Sorensen DCS Series power supply (1.0 kW, 600 VDC). DC switch to shunt the output of the Sorensen DCS power supply to any of the (2) installed cathodes. Substrate Stage: 6.0 inch omni rotating fixture plate (sputter-down configuration). Speed adjust via input to system touch screen.

Sputtering System. The Auto 500 box chamber system is a versatile front loading thin film system for Research & Development or preproduction.  The chamber is mounted on a pedestal, housing the pumping stack. A rack panel next to the vacuum pedestal houses controls for vacuum and all thin film processes accessories. Three RF magnetron cathodes, two are 4 in. dia. and one is 3 in. dia.  Rotating Substrate Carrier: 11 in. dia.  Includes RF etch.  Crystal film thickness monitor.  Turbo pump with controller and roughing pump.

Deposition System with Low Temp Organic Source and Resistive Evaporation. Front loading thin film deposition system for research and development or pre-production. System has a total of three evaporation sources, two standard resistive sources and one Kurt J. Lesker low temperature source for organics. Dual crystal deposition film thickness monitor. Substrate rotation controller. Single shudder. Controller for substrate heat but does not have heaters. Dry scroll pump in base for chamber roughing. CTI cryopump with compressor for high vacuum pump down. CE marking. System can deposit one source at a time or can do codeposition.