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Dicing Saws-Scribers

Used K&S 982-6

Inventory Number: 61275
Now (USD): $15,000.00

K&S 982-6 Precision Dicing Saw. Precision dicing, cutting and slotting for the semiconductor and microdevices industries. Process parameters are totally programmable through interactive menu-driven screens. 6-inch dia. vacuum chuck. Air bearing spindle with 2-inch dia blade and maximum speed of 40,000 rpm. Video viewing of alignment and cutting.

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Used Aremco Accu-Cut 5200

Inventory Number: 61730
Now (USD): $6,500.00

Aremco Accu-Cut 5200 Ultra Hard Material Dicing Saw. Used to cut a wide range of ultra-hard materials such as ceramics, ferrites and quartz, as well as semiconductor materials including silicon, gallium arsenide and bismuth telluride. The Accu-Cut Model 5200 is a compact, semiautomatic system for laboratory and production applications on substrates up to 4 in. x 4 in. x 3/4 in. thick. It comes equipped with a 5,000 rpm fixed speed spindle, a manual indexing Y-stage and an air/oil in-feed for maintaining smooth, precise stage control. Parts are mounted with a pneumatic vise or vacuum manifold to a 360° theta stage for part alignment, and a monocular microscope.

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Used Lintec RAD-2500F/8

Inventory Number: 62399
Now (USD): $49,000.00

Lintec RAD-2500F/8 Fully Automatic Wafer Tape Frame Mounter. Consists of alignment function and tape tension control system which reduces voids at lamination. Currently configured for 200mm wafer size. 8-inch frame table (DTF2-8-1 Disco). Ring frame, heater spec. 6-inch VN wafer and 6-inch wafer cassette compliance. Protrusion sensor. 200-230V, 1 Ph, 50/60 Hz, 8A. Date of Mfg.: 2011.

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Used Leco PR-35

Inventory Number: 56580
Now (USD): $3,950.00

Leco PR-35 Automatic Dual Mount Dual Mold Pneumatic Sample Mounting Press. Two sample mounting presses in one package. Mold diameter: 2 in. Thermostatically controlled heater with integral water cooler. Direct reading pressure gauge. Additional 1-1/4 in. heater molding head. 230V, 1 Ph, 50/60 Hz, 11A.

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Used MTI STX-202A

Inventory Number: 63832
Now (USD): $4,950.00

MTI STX-202A Small Precision Diamond Wire Saw. Small precision diamond wire saw for cutting less than or equal to 2-inch dia. or square up to 50mm in thickness. It is designed to provide a smooth cutting for many kinds of materials especially for fragile crystals and TEM or IC sample by using 0.28mm dia. x 20 meter long diamond impregnated wire. It is ideal cutting tool for material research. Stage Traveling Distance: Z axis: 50mm, automatically controlled by digital panel. Y axis: 50mm, automatically controlled by digital panel. Controller and Touch Screen: The saw wire moves along the Z-axis to implement cutting according to user defined program which specifying the cutting length, feed speed, back, speed, and spooler spinning speed. The feed speed is able to be set from 0.0lmm/min to 20mm/min. ITEM IS ALREADY TESTED SEE VIDEO DEMONSTRATION AT https://youtu.be/iNpt3U_AcKQ

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Used Ultron Systems UH114-8

Inventory Number: 63857
Now (USD): $4,950.00

Ultron UH 114-8 Wafer Frame Film Applicator.  Features an easily adjustable spring-loaded roller assembly, along with film-tensioner bars along both the x- and y-axes to ensure bubble-free lamination of the film to the wafer and film frame. Temperature controlled chuck. Operates with backed or non-backed film. 8-inch diameter maximum wafer size. Retractable film cutting system with adjustable cutting pressure to accommodate various tape base materials and thicknesses. Roller pressure is adjusted from the topside of the units for different process requirements and to accommodate various wafer thicknesses. 115V, 1 Ph, 50/60 Hz, 3A.

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