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Dicing Saws-Scribers

Used ADT Advanced Dicing Technologies 982-6

Inventory Number: 54731
Now (USD): $15,000.00

Precision Dicing Saw. Precision dicing, cutting and slotting for the semiconductor and microdevices industries. Process parameters are totally programmable through interactive menu-driven screens. 6 in. dia. vacuum chuck. Air bearing spindle with 2 in. dia blade and maximum speed of 40,000 rpm. Video viewing of alignment and cutting. Date of Mfg.: 9/2004.

Product Details

Used Allied High Tech Model 4000

Inventory Number: 60750
Now (USD): $3,500.00

Precision Sectioning Saw. Sample capacity is up to 2.5 in. thick and 8 in. in length. Variable Speed: 100 to 4000 rpm. Recirculating coolant system. 3 in. to 8 in. blade capacity. 120V, 60 Hz.

Product Details

Used Aremco Accu-Cut 5200

Inventory Number: 61730
Now (USD): $6,500.00

Ultra Hard Material Dicing Saw. Used to cut a wide range of ultra-hard materials such as ceramics, ferrites and quartz, as well as semiconductor materials including silicon, gallium arsenide and bismuth telluride. The Accu-Cut Model 5200 is a compact, semiautomatic system for laboratory and production applications on substrates up to 4 in. x 4 in. x 3/4 in. thick. It comes equipped with a 5,000 rpm fixed speed spindle, a manual indexing Y-stage and an air/oil in-feed for maintaining smooth, precise stage control. Parts are mounted with a pneumatic vise or vacuum manifold to a 360° theta stage for part alignment, and a monocular microscope.

Product Details

Used Benetec Labcut 250F

Inventory Number: 61193
Now (USD): $8,500.00

Floor Model High Speed Abrasive Cutting Saw. Manually operated and designed for using up to a 250 mm/10-inch cutting wheel for the general work in materials laboratory. 208V, 3 Ph, 60 Hz, CE.

Product Details

Used Disco DAC-2SP/86

Inventory Number: 38633
Now (USD): $12,500.00

Automated Dicing Saw. Max. Substrate Size: 150 mm. Range of Indexing: 0.0001 to 99.9999 mm. Minimum Step Indexing: 0.00025 mm. Spindle Rotation: 3000 to 40,000 rpm. Older dicing saw but in good condition.

Product Details

Used Disco DAD522

Inventory Number: 58774
Now (USD): $17,000.00

Precision Automatic Wafer Dicing Saw. Extra-high precision automatic cutting saw for cutting materials such as silicon wafers, glass and small electronic parts made of ceramic. Work Piece Size: 152mm. Theta Axis Rotation: 380 degrees. Dual objective split image microscope. 1.5 kW Synchro Spindle™. Requires house air and water. 200V, 3 Ph, 50/60 Hz.

Product Details

Used K&S 984-6

Inventory Number: 56722
Now (USD): $21,500.00

Precision Dicing Saw for Hard Materials. 4 in. dicing technology for superior sawing. Automated process control. For cutting hard materials up to 6 in. dia. Sub-micron accuracy. 4 in. spindle. 208V, 1 Ph, 50/60 Hz, 15A.

Product Details

Used K&S Spindle

Inventory Number: 57218
Now (USD): $2,500.00

984 Dicing Saw 4 inch Spindle. Rebuilt.

Product Details

Used K&S 7100 AD

Inventory Number: 56732
Now (USD): $25,000.00

Precision Wafer Dicing Saw. Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield. Up to 200mm x 200mm work area, 6 in. dia. porous vacuum chuck currently installed. Z Axis Travel: 50mm. Blade Capacity: 2 in. to 3 in. Spindle speed programmable up to 60,000 rpm. 200/240V, 1 Ph, 50/60 Hz, 15A.

Product Details

Used K&S 7100 ADHM

Inventory Number: 60629
Now (USD): $29,000.00

Precision Dicing Saw Suitable for Hard Materials. Windows based operating system. 4 in. spindle programmable to 30,000 rpm. Blade Size: 4 in. to 5 in. 6 in. dia. porous vacuum chuck. Indexing Axis Resolution: 0.2 micrometers. 200-240V, 1 Ph, 50/60 Hz, 15A.

Product Details