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Bonders - Welders

Reliability, accuracy and consistency is critical to effective wire bonding and ball bonding, especially in high production environments. Finding or replacing well-made, dependable bonders, welders and associated machinery that you can trust makes all the difference between outputting quality electrical connections and unacceptable failure rates.

At Bid Service, we source, refurbish and supply high-quality wire bonding equipment, including manual wire bonders, automatic wire bonders, parts and spares. We carry a range of equipment from various original manufacturers, including K&S Wire Bonders. All our used wire bonding equipment is thoroughly vetted and tested before we acquire it, and is put through a stringent refurbishment process. We rigorously test, recalibrate and update each piece of equipment as needed to make it like new before selling it on to you.

We endeavour to carry a full and comprehensive range of refurbished wire bonding, ball bonding, lead attach welding, and hot bar soldering systems and more. As refurbishers and distributors of quality second-hand bonders and welders, our range can vary from time to time and we recommend browsing our site regularly, or getting in touch to find out if we’re carrying what you need.

We also buy used bonders and welders, so if you have any used equipment you wish to replace, or if you are moving, closing down a section of your operations, or need to sell a full operation, we will assess your second-hand equipment and make you an offer.

Used Avio PHU-10

Inventory Number: 52634
Now (USD): $950.00

Avio PHU-10 Pulse Heating Power Supply with NT-5A Transformer.

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Used Benchmark System 2000

Inventory Number: 61894
Now (USD): $500.00

Benchmark System 2000 Seam Sealer Package Welder. As Is, only what is in photo. No power supply or computer.

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Used Branson SW-200

Inventory Number: 64551
Now (USD): $12,500.00

Branson SW-200 Spin Welder. The Branson SW200 is a precision servo-driven spin welding system capable of welding circular parts with accurate control. It is easy to set up and operate. The SW200 is designed for use in manual, semi-automated, or fully-automated environments. A free-standing operator interface allows for the following adjustments: revolutions per minute (RPM), revolutions per cycle (RPC), and hold time (HT). Adjustable RPC (revolutions per weldcycle). This provides for consistent weld results. Rapid deceleration provides high-strength bonds. Adjustable hold time. Adjustable height (18"/457 mm) andstroke (up to 3.5"/89 mm) provide ease of setup. 208V, 1Ph, 60Hz, 20A

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Used Dage 4000-BS5KG-R

Inventory Number: 64794
Now (USD): $2,500.00

Dage 4000-BS5KG-R Ball Shear 5KG Load Cell with Rotation. Tested Good.

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Used Dage 4000-BS250

Inventory Number: 64793
Now (USD): $1,950.00

Dage 4000-BS250 Ball Shear Linear Load Cell. Fully Tested.

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Used Hybond 626

Inventory Number: 64833
Now (USD): $15,000.00

Hybond 626 Multipurpose Digital Thermosonic Wire Bonder, Ball Bonder, Wedge Bonder, Bump or Stud Bonder, Peg Bonder and more. Model 626 is a Deep Access, Long Reach Wire Bonder that can operate as a Ball, Wedge, Bump or Peg bonder. It can be used for wire diameters from 0.7 to 3.0 mil (18 to 76μm) gold wire when in Ball/Bump bonder configuration, or wire diameters from 0.5 to 3.0 mil (12,7 to 76μm) and ribbon up to 1.0 x 20.0 mil (25,4 x 510μm) for Wedge or Peg bonding configuration. The 626 was specifically designed for applications that require bonding at extreme height differences between 1st and 2nd bond and for bonding wires to sensitive devices such as gallium arsenide FET's, MMICs and LED's. Model 626's motorized wire feed and wire/ribbon clamping system provide superior wire/ribbon control and allow the operator to increase or decrease tail length in 1 mil (25μm) increments at a touch of a switch. The 626 shows actual units for set up of bond parameters. The change over from Ball bonder to Wedge bonder requires only a press of a button to turn EFO power to zero and a change from capillary to wedge tool. 110V, 50/60Hz.

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Used Hypervision Chip Unzip

Inventory Number: 48882
Now (USD): $3,500.00

Hypervision Chip Unzip Backside Preparation System. Low stress backside preparation system is useful for the development and analysis of flip-chips, lead-on-chips packaging and advanced chip design with more than 3 metallization layers. Software controlled milling to remove semiconductor packaging materials: epoxy molding compound, ceramic, metal and perform backside thinning on silicon die.

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Used K&S 4522

Inventory Number: 64719
Now (USD): $13,950.00

K&S 4522 Manual Gold Ball Wire Bonder With heated work holder. For process development, production, research or added manufacturing support. Provides the high yield and excellent repeatability needed. Consistent ball size via negative electronic flame-off. Missing ball detection and auto-stop. Consistent tail length with fine adjustment on operator panel. Phase Locked Loop (PLL) ultrasonic generator and high-Q transducer.115V, 50/60Hz, 4A

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Used K&S 4524

Inventory Number: 64725
Now (USD): $13,950.00

K&S 4524 Manual Gold Ball Bonder. Versatile production capabilities for bonding applications from simple to discrete devices up to complex hybrid, microwave devices. Built-in programmable negative electronic flame-off system provides ball size fine control and consistency. Includes Heated specimen work holder. Digital logic controls all machine functions, including ball size and tail length. StereoZoom microscope. Includes fiber optic spotlight target and lighting option. 115V, 50/60 Hz, 4A, CE.

Product Details

Used Leko L930U

Inventory Number: 60373
Now (USD): $4,950.00

Leko L930U Pulse Heat Alignment and Bonding TAB/FPC onto TFT/LCD. LCD repair machine. Connect TAB/FPC onto TFT/ LCD. Soft soldering technics to connect FPC FFC onto PCB: Connect single core axes onto plugs. Applied to seal LCD modules in cell phones, electronic translators, PDA, digital cameras, pins of computers.Precise temperature control system. PLC to multi-point control the operation of the machine. Collocate one or two sets of high precision CCD systems. Standard Size of Bonding Blade: 60x2 (mm) MAX. Camera: White and Black /color 1/3 interface. Temp. Range: Room temperature to 400 deg C +/-1 deg C. Time Range: 0.1S - 999H +/-0.1S.  Pressure Range: 0.15 - 0.5 Mpa. Heat Up Time: 100 - 300 deg C 4 - 8S.

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