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Bonders - Welders

Reliability, accuracy and consistency is critical to effective wire bonding and ball bonding, especially in high production environments. Finding or replacing well-made, dependable bonders, welders and associated machinery that you can trust makes all the difference between outputting quality electrical connections and unacceptable failure rates.

At Bid Service, we source, refurbish and supply high-quality wire bonding equipment, including manual wire bonders, automatic wire bonders, parts and spares. We carry a range of equipment from various original manufacturers, including K&S Wire Bonders. All our used wire bonding equipment is thoroughly vetted and tested before we acquire it, and is put through a stringent refurbishment process. We rigorously test, recalibrate and update each piece of equipment as needed to make it like new before selling it on to you.

We endeavour to carry a full and comprehensive range of refurbished wire bonding, ball bonding, lead attach welding, and hot bar soldering systems and more. As refurbishers and distributors of quality second-hand bonders and welders, our range can vary from time to time and we recommend browsing our site regularly, or getting in touch to find out if we’re carrying what you need.

We also buy used bonders and welders, so if you have any used equipment you wish to replace, or if you are moving, closing down a section of your operations, or need to sell a full operation, we will assess your second-hand equipment and make you an offer.

Used ASM AB356

Inventory Number: 58256
Now (USD): $950.00

Fully Automatic Ball Bonder. Sold As Is.

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Used Avio PHU-10

Inventory Number: 52634
Now (USD): $950.00

Pulse Heating Power Supply with NT-5A Transformer.

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Used Avio TCW-115A-C

Inventory Number: 52626
Now (USD): $2,950.00

TEC Lead Attach Welding System. Avio super welder NA-62D head. Model TCW-115A power supply. Analog power setting. Settings for first heat and second heat time and temperature.

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Used Benchmark System 2000

Inventory Number: 61894
Now (USD): $500.00

Seam Sealer Package Welder. As Is, only what is in photo. No power supply or computer.

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Used Dage 4000HS

Inventory Number: 59527
Now (USD): $19,500.00

High Speed Bond Tester Dage 4000HS bondtester is based upon the industry standard Nordson Dage 4000 multi-purpose bondtester platform. The 4000HS has significant differences to the mode of operation for both shear and pull modes with speeds up to 4m/sec for shear and 1.3m/s for pull. The 4000HS bondtester also offers advanced analysis options, specifically force versus displacement graphs and energy measurements in addition to the conventional peak force measurement. The Nordson Dage 4000HS bondtester provides high speed bondtesting for the assessment of failure mode rather than measurement of failure force. Does not include a load cell! Must purchase load cell from manufacturer. 110-240V, 50/60 Hz, 5/3.1A, CE.

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Used Dage TP5KG

Inventory Number: 61359
Now (USD): $2,500.00

Dage 4000 5 kg Tweezer Pull Load Cell. 

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Used Dage 4000P

Inventory Number: 60120
Now (USD): $19,000.00

Modular Wire Pull/Die Shear Bond Tester. Intuitive operating screens enable quick test set up and editing of parameters. Windows based software. Motorized stage allows for semiautomatic bond testing. Currently configured with TP5KG wire pull load cell. Other load cells for different applications may be available at additional cost, ask salesperson. StereoZoom microscope. 110V, 230V, 1 Ph, 50/60 Hz, CE.

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Used Dage 4000BS5KG

Inventory Number: 59972
Now (USD): $2,500.00

Dage 4000 Ball Shear Load Cell. 5kg capacity.

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Used Dymax PC-2

Inventory Number: 61957
Now (USD): $950.00

UV Curing Light. Light shape for cure 9 in. x 9 in. Spectral Output: 300-500nm. Bulb Rating: 400W. Power supply. Ideal for batch curing or bonding larger parts. 120V, 60 Hz, 4A.

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Used Dynatex DXB-120-01

Inventory Number: 62252
Now (USD): $6,500.00

DXB 120 Series Wafer Bonder. The DXB 120 is used for process development and small scale production. With its larger heated vacuum chamber the DXB 120 supports larger wafers. Heated Vacuum Chamber: 11.25 in. dia. On board timer is used to set the bonding process duration. Temp. Range: 100-320deg F (40-160 deg C). Cycle Time Range: 1 sec - 10 min. Power: 100/120 VAC, 10A, 50/60 Hz. Vacuum Required: 18-25 inHg. Used for mounting wafer substrate. Improves bond quality and repeatability while improving process time during lapping, polishing and dicing.

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