Used K&S 4524

K&S 4524 Manual Gold Ball Bonder. Versatile production capabilities for bonding applications from simple to discrete devices up to complex hybrid, microwave devices. Built-in programmable negative electronic flame-off system provides ball size fine control and consistency. Does not have Heated work holder. Must purchase separately. Digital logic controls all machine functions, including ball size and tail length. StereoZoom microscope. 115V, 50/60 Hz, 4A, CE. Includes fiber optic spotlight target and lighting option.

K&S 4524AD Programmable Digital Ball Bonder. Manages 200 programs with up to six channels per program. Motorized Y axis and programmable auto-stepback function for precise wire length and loop formation. Digital readout of all bonding parameters. Auto-second bond mode. Fiber optic illuminator and spotlight targeting option. Heated work holder and controller included. StereoZoom microscope. 115V, 50/60 Hz, 4A, CE.

K&S 4524D Programmable Digital Ball Bonder. Manages 200 programs with up to six channels per program. Digital readout of all bonding parameters. Wire Size: 0.7 mil to 3.0 mil, depends on tooling installed. Includes optional heated work holder, StereoZoom microscope and fiber optic illuminator and targeting. 115V, 50/60 Hz, 4A, CE

Avio PHU-10 Pulse Heating Power Supply with NT-5A Transformer.

Leko L930U Pulse Heat Alignment and Bonding TAB/FPC onto TFT/LCD. LCD repair machine. Connect TAB/FPC onto TFT/ LCD. Soft soldering technics to connect FPC FFC onto PCB: Connect single core axes onto plugs. Applied to seal LCD modules in cell phones, electronic translators, PDA, digital cameras, pins of computers.Precise temperature control system. PLC to multi-point control the operation of the machine. Collocate one or two sets of high precision CCD systems. Standard Size of Bonding Blade: 60x2 (mm) MAX. Camera: White and Black /color 1/3 interface. Temp. Range: Room temperature to 400 deg C +/-1 deg C. Time Range: 0.1S - 999H +/-0.1S.  Pressure Range: 0.15 - 0.5 Mpa. Heat Up Time: 100 - 300 deg C 4 - 8S.

Hypervision Chip Unzip Backside Preparation System. Low stress backside preparation system is useful for the development and analysis of flip-chips, lead-on-chips packaging and advanced chip design with more than 3 metallization layers. Software controlled milling to remove semiconductor packaging materials: epoxy molding compound, ceramic, metal and perform backside thinning on silicon die.

Benchmark System 2000 Seam Sealer Package Welder. As Is, only what is in photo. No power supply or computer.

West Bond 7372B Convertible Epoxy & Eutectic Die Bonder. Simple change of a tool head allows for use as either epoxy or eutectic die bonder. With pick-up tool rotation and radiant heat. Microprocessor controller with LCD display. StereoZoom microscope.

K&S 4524 Manual Gold Ball Bonder. Versatile production capabilities for bonding applications from simple to discrete devices up to complex hybrid, microwave devices. Built-in programmable negative electronic flame-off system provides ball size fine control and consistency. Does not have Heated work holder. Must purchase separately. Digital logic controls all machine functions, including ball size and tail length. StereoZoom microscope. 115V, 50/60 Hz, 4A, CE. Includes fiber optic spotlight target and lighting option.

Branson SW-200 Spin Welder. The Branson SW200 is a precision servo-driven spin welding system capable of welding circular parts with accurate control. It is easy to set up and operate. The SW200 is designed for use in manual, semi-automated, or fully-automated environments. A free-standing operator interface allows for the following adjustments: revolutions per minute (RPM), revolutions per cycle (RPC), and hold time (HT). Adjustable RPC (revolutions per weldcycle). This provides for consistent weld results. Rapid deceleration provides high-strength bonds. Adjustable hold time. Adjustable height (18"/457 mm) andstroke (up to 3.5"/89 mm) provide ease of setup. 208V, 1Ph, 60Hz, 20A