Category Feed Subscribe to this Channel's RSS Feed

Bonders - Welders

Reliability, accuracy and consistency is critical to effective wire bonding and ball bonding, especially in high production environments. Finding or replacing well-made, dependable bonders, welders and associated machinery that you can trust makes all the difference between outputting quality electrical connections and unacceptable failure rates.

At Bid Service, we source, refurbish and supply high-quality wire bonding equipment, including manual wire bonders, automatic wire bonders, parts and spares. We carry a range of equipment from various original manufacturers, including K&S Wire Bonders. All our used wire bonding equipment is thoroughly vetted and tested before we acquire it, and is put through a stringent refurbishment process. We rigorously test, recalibrate and update each piece of equipment as needed to make it like new before selling it on to you.

We endeavour to carry a full and comprehensive range of refurbished wire bonding, ball bonding, lead attach welding, and hot bar soldering systems and more. As refurbishers and distributors of quality second-hand bonders and welders, our range can vary from time to time and we recommend browsing our site regularly, or getting in touch to find out if we’re carrying what you need.

We also buy used bonders and welders, so if you have any used equipment you wish to replace, or if you are moving, closing down a section of your operations, or need to sell a full operation, we will assess your second-hand equipment and make you an offer.

Used ESEC 3018 AWB

Inventory Number: 46614
Now (USD): $15,000.00

Automated Gold Ball Bonder. Flying bondhead operates by means of a frictionless air bearing. System has programmable focus option. E-Stop and Venturi vacuum. 2 in. x 2-1/2 in. work table travel. Programmable X-Y-Z indexer. Currently 80 micron machine but upgradable to 65 micron. Installation and custom configurations available at added cost.

Product Details

Used Hypervision Chip Unzip

Inventory Number: 48882
Now (USD): $3,500.00

Backside Preparation System. Low stress backside preparation system is useful for the development and analysis of flip-chips, lead-on-chips packaging and advanced chip design with more than 3 metallization layers. Software controlled milling to remove semiconductor packaging materials: epoxy molding compound, ceramic, metal and perform backside thinning on silicon die.

Product Details

Used K&S MWB Maintenance Tool Kit

Inventory Number: 60178
Now (USD): $300.00

4500 Series Wire Bonder maintenance kit.

Product Details

Used K&S 4124

Inventory Number: 54581
Now (USD): $6,500.00

Manual Gold Ball Bonder. Does not include heated work holder. Versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 300 mils. Extremely accurate loop and force control. Wire Range: 0.7 to 3.0 mil. 120V, 60 Hz.

Product Details

Used K&S 4500 Series

Inventory Number: 60761
Now (USD): $950.00

Wire Bonder Spot Light Targeting Option. Fiber optic illuminator and spotlight fiber optic targeting for aligning bonds.

Product Details

Used K&S 4526

Inventory Number: 61388
Now (USD): $14,500.00

Auto Stepback Deep Access Wedge Bonder. Designed for aluminum wire, gold wire and ribbon. Appropriate for high quality applications that require tight control of wire length and loop formation. Offers control of individual bond parameters and programmable loop formation. Ideal for deep cavity microwave applications. Features: One bonding head for deep access and standard bonding. Programmable loop formation. Consistent tail length with real time fine adjust. Large bonding area. Easy operation. Wire: Gold 12.7 to 76 micrometers. Aluminum 20 to 76 micrometers. Gold ribbon. Motorized Y: Stepback up to 4mm reverse up to 0.25mm kink height up to 0.5mm. Modes of Operation: Semiauto, Manual Z, Stitch, Lange Coupler. Includes optional heated work holder, fiber optic illuminator and spotlight targeting. Includes StereoZoom microscope. CE marked.

Product Details

Used K&S 4123

Inventory Number: 48517
Now (USD): $6,500.00

Manual Universal Wedge Bonder. An aluminum or gold wire bonder versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 200 mils. With spotlight target option. Wire Diameter Range Gold: 0.5 to 3.0 mil. Aluminum: 1.0 to 3.0 mil. 120V, 60 Hz.

Product Details

Used K&S 4526

Inventory Number: 61580
Now (USD): $13,950.00

Auto Stepback Deep Access Wedge Bonder. Designed for aluminum wire, gold wire and ribbon. Appropriate for high quality applications that require tight control of wire length and loop formation. Offers control of individual bond parameters and programmable loop formation. Ideal for deep cavity microwave applications. Features: One bonding head for deep access and standard bonding. Programmable loop formation. Consistent tail length with real time fine adjust. Large bonding area. Easy operation. Wire: Gold 12.7 to 76 micrometers. Aluminum 20 to 76 micrometers. Gold ribbon. Motorized Y: Stepback up to 4mm reverse up to 0.25mm kink height up to 0.5mm. Modes of Operation: Semiauto, Manual Z, Stitch, Lange Coupler. Includes optional heated work holder. Includes StereoZoom microscope. 115V, 50/60 Hz, 4A, CE.

Product Details

Used K&S 4523AD

Inventory Number: 60452
Now (USD): $13,950.00

FULLY TESTED AND READY TO SHIP! Video Demo Available.

Programmable Digital Manual or Semiautomatic Wedge Bonder with Auto Stepback Y Axis. Standard or deep access wedge bonder tool. System manages 200 programs with up to six channels per program. Manual or semiautomatic operation. Motorized Y axis and programmable auto-stepback function for precise wire length and loop formation. Auto-second bond mode for complete single wire programmed sequence. Digital readout of all bonding parameters. Includes heated work holder option. Includes StereoZoom microscope with fiber optic illuminator and spotlight targeting. 115V, 50/60 Hz, 4A, CE.

Product Details

Used K&S 4526

Inventory Number: 61629
Now (USD): $12,950.00

Auto-Stepback Wedge Bonder. Designed for aluminum wire, gold wire and ribbon. Appropriate for high quality applications that require tight control of wire length and loop formation. Offers control of individual bond parameters and programmable loop formation. Ideal for deep cavity microwave applications. Features: One bonding head for deep access and standard bonding. Programmable loop formation. Consistent tail length with real time fine adjust. Large bonding. Easy operation. Wire: Gold: 12.7 to 76 micrometers. Aluminum: 20 to 76 micrometers. Motorized Y: Stepback up to 4mm, reverse up to 0.25mm. Kink height up to 0.5mm. Modes of Operation: Semi-auto, Manual Z, Stitch, Lange Coupler. Includes spotlight target option. Does not come with a work holder. 115V, 50/60 Hz, 4A, CE.

Product Details