New Arrivals

UVOCS T16X16/OES Ultraviolet Ozone Cleaning System. Cleaning or oxidation with the UVOCS is accomplished by the combination of ultraviolet light and ozone.  Low pressure quartz-mercury vapor lamp which generates UV emissions in the 254 and 185 nanometer range.  Source Size: 16” x 16”. Active Area: 256 sq. in. Width: 20”. Depth: 29¾”. Height: 14½ ”. 110 V, 60 Hz, 5.0A

UVOCS T10X10-OES Ultra Violet Ozone Cleaning System. UV/Ozone cleaning process provides a simple, inexpensive, fast method of obtaining ultra-clean surfaces free of organic contaminants on most inorganic surfaces, such as quartz, silicon, gold, nickel, aluminum, gallium, arsenide, alumina†, etc.  The process is ideal when thin film deposition with excellent adhesion to the substrate is required.  Ultra-clean surfaces can easily be achieved by UV/Ozone processing in one to several minutes after the substrate has been cleaned by conventional techniques. Active Area: 100” squared. Sliding parts tray height to 1.5”. Lamp units 245nm UV. Digital controller. 115V, 60 Hz, 2.5A

Vacuum Atmosphere Nexus Glovebox with Oven and Moisture and Oxygen Analyzers. The VTB oven is a heat reflective, oven for operation to 200° C. Nexus instrumentation computer that monitors and controls system through an easy to use menu driven interface. Stainless steel construction. Moisture and trace oxygen analyzers. 15-inch dia. antechamber and 6-inch dia. mini-antechamber. Vacuum pump. Dri-Train with blower. Bed media will be replaced during refurbishment. Fluorescent lights.

Varian V-70 Turbo with Controller. Conflat flange 4.5"OD and 2.75" ID. Controller does not have a front panel display, remote operations only. 120V, 50/60Hz

View Pinnacle 250 Video Measuring Tool. The Pinnacle features a damped granite base and column, with passive vibration isolation. A precision compound X-Y stage with high-speed linear motor drives provides velocity of 400 mm / sec and acceleration of 1000 mm / sec2. This combination of high acceleration and high velocity enables the high throughput required for near-line process monitoring. The rugged and compact design of the Pinnacle lends itself to installation in either a Q/A lab or at an inspection station in the manufacturing line.

The Pinnacle is ideal for measurement of small, close tolerance parts, particularly parts with a high density of features, such as hard disk drive suspensions, printer heads, precision stampings, leadframes, ball-grid arrays, and chip scale packages.

West Bond 7700E-79 Thermosonic Ball to Wedge Wire Bonder. Wire Bonder Bonds gold wires ranging from 0.0007” to 0.002”. Three-axis manual micromanipulator, entire mechanism arrayed above the work plane, so there is no limit to size of work piece. All machine configuration constants and bond settings are programmable, prompted by a series of screens. Heated work holder with digital control. 115V, 50/60 Hz, 10A

West Bond 4KE Semi-Automatic, Motorized Y/Z Axes, Wedge-Wedge, Ball-Wedge Convertible Wire Bonder. Series 4KE models are three-way convertible Semi-Automatic wire bonders of a gantry design. The entire mechanism is arrayed above the work plane, so that it is wide open to accommodate different size and style of work packages. Two-axes X and Y are driven manually by unique West·Bond micro-manipulator for positioning. Microprocessor controlled W (in Y direction) and Z axes are driven by program controlled motors to arch the connection. It is capable of creating a series of parallel, single or multiple arched wires while maintaining identical loop and bond shapes. Cross roller bearings rigidly guided axes are moving orthogonally, with independent pneumatic brakes in X and Y applied on signal. Target the critical bond location manually with the manipulator via moving the crosshairs generated on the screen and image captured from vertical view CCTV camera, then the target will be secured by the brakes to proceed with programmed bonding. A dual force mechanism, operated pneumatically, acts to change between two pre-set force values, and either high or low force may be programmed for any bond. Radiant tool heat with panel mounted, controlled by constant current. With simple exchange of clamp assemblies, bond tool, and wire path provided with the software mode will allow quick conversion between conventional 45º wire feed, deep access wire or ribbon, ball bonding, insulated wire and single point tab / lead bonding. All programmed bond variables as well as machine settings for each bond mode are retained in the machines memory. Bond Force: 10 – 150 grams; (High / Low programmable). Au / Al: 0.7 to 3 mil, Ribbon: 0.5x2 to 1x10 mil, Au Ball Bonding: 0.7 to 2 mil. 115V, 50/60Hz, 3.2A

West Bond 7700E-79 Thermosonic Ball to Wedge Wire Bonder. Wire Bonder Bonds gold wires ranging from 0.0007” to 0.002”. Three-axis manual micromanipulator, entire mechanism arrayed above the work plane, so there is no limit to size of work piece. All machine configuration constants and bond settings are programmable, prompted by a series of screens. Heated work holder with digital control. 115V, 50/60 Hz, 10A