Plasmatherm SLR ICP Shuttle Lock ICP Inductively Coupled Plasma Etch System. PC controller. Vacuum load lock with wafer transfer robot. Can process wafers from 2” to 8” depending on which process kit is installed. Currently configured with 4” kit.  High frequency RF-based inductively coupled plasma source capable of high density plasma generation. Closed loop pressure control. Turbo pump with roughing pump. Total of eight MFC gas controllers. Includes water chiller and roughing pump. 208V, 3Ph, 60Hz

Polycold PFC-550LT Fast Cycle Water Vapor Cryochiller. The Polycold Fast Cycle Water Vapor Cryochillers (PFC) effectively captures water vapor, which comprises 65% to 95% of the residual gas in high-vacuum systems. Water vapor is typically the most reactive contaminant present. With the PFC cryochillers, you can expect to increase product throughput in your existing system 20% to 100% and improve quality of deposition. Sold AS IS with no refrigeration charge.

Polycold PFC-660-HC Fast Cycle Water Vapor Cryochiller. The Polycold Fast Cycle Water Vapor Cryochillers (PFC) effectively captures water vapor, which comprises 65% to 95% of the residual gas in high-vacuum systems. Water vapor is typically the most reactive contaminant present. With the PFC cryochillers, you can expect to increase product throughput in your existing system 20% to 100% and improve quality of deposition. Sold AS IS with no refrigeration charge.

PVA TEPLA 660 Microwave Plasma Cleaning System. Low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation. The electrode-free energy feeding is the key factor for processing substrates in their original, unslotted magazines. Microwaves of 2.45 GHz are simply applied through a window in the wall of the vacuum chamber producing a largely extended plasma there. Unslotted magazines are processed in a downstream configuration, slotted magazines are more properly placed on a rotating platform. Any size of magazine can be processed. Due to the use of microwaves the plasma systems 400 and 660 provide for fast and damage-free plasma processing. In these plasma systems the plasma cleaning effect is based on chemical reactions of reactive plasma particles (radicals) guided through the substrate carriers. The systems are easy to operate and feature simpliest loading and unloading, manually as well as automatically. System software complies with standards in semiconductor industries. Currently configured with three gas inputs plus purge gas. Chamber size 15" x 15" x 15". System comes with rotary vane vacuum pump.

PVA TEPLA ION 100 Plasma Treatment System.

Features Include:

• Plug and play self installation
• Flexible electrodes
• Industrial computer with LCD touch panel and keyboard.
• Windows based operating system.
• Graphical User Interface (GUI) software complies with
• CFR Title 21 Part 11 and Semi E95-1101
• Multi-level user access
• Software
  • Recipe editor for fast and versatile step controls
  • Onboard diagnostic features and alarm logging
  • Remote process monitoring via Ethernet
  • Online web based simulation/training/support
• Pump power outlet on the chassis
• Energy saving feature—pump control

TYPICAL APPLICATIONS:

• Surface cleaning
• Surface activation
• Surface functionalization
• Deposition of siloxane and organic thin films

Technical Data

Process Chamber

Material: Aluminum
Dimension: 375 mm W x 762 mm D x 375 mm H
(14.75”x30”x14.75”)
Volume: 107 L (3.78 ft3)
Electrodes: 7 Shelf- each shelf 12.5" x 24.5"
Number of MFCs: 3
Process Pressure: (0.16 to 2.66) mbar
(120 to 2000) mTorr
Base Pressure: 0.07 mbar (50 mTorr)
Pumping Time: 1 min (Pump dependent)
Loading: Manual

Plasma Generator Frequency/power: 13.56 MHz/1000 W

230V, 3Ph, 50/60Hz

RETSCH Safety Jar Clamp for grinding jars 250 ml. 2 Available

RETSCH Aerated Cover "C", for grinding jar 250 ml, zirconium oxide. Made from durable zirconium oxide, it is resistant to wear and corrosion, ensuring a long lifespan even under demanding conditions. 2 Available.

RETSCH 250 ml, C Zirconia, Grinding jars,PM 100 / PM 200 / PM 400. 

The RETSCH 14620219, 250 ml, C Zirconia, Grinding jars are an essential tool for efficient grinding in the PM 100, PM 200, and PM 400 models. Designed to enhance the performance of your grinding processes, these jars offer a reliable and durable solution. Crafted with high-quality zirconia material, these grinding jars guarantee exceptional resistance to wear and corrosion. This ensures a longer lifespan and consistent performance, making them ideal for both wet and dry grinding applications. The robust construction of these jars allows for intense grinding processes without the risk of deformation or breakage. ZrO2 Milling Jar.

RETSCH RM100 Mortar Grinder. Used to grind, mix and triturate soft, hard, brittle and pasty materials. Easy pestle pressure adjustment and scraper pressure settings. Rotary speed of the mortar is 90 rpm. 110V, 60 Hz.

Rohde & Schwarz RT-ZHD60 100 MHz High Voltage Differential Probe. 

100 MHz high voltage differential probe, 6000 Vpk, 1000 V CAT III, 1000:1/100:1, 40 MOhm // 2,0 pF (differential), including accessories (soft bag, R and S RT-ZA22 safety test leads, R and S RT-ZA24 accessory set)