Oxford Instruments OPAL ALD Atomic Layer Deposition System. The Oxford OpAL is a plasma or thermal assisted atomic layer deposition system ALD. It is an open loop (non-loadlocked) tool which had two channels for metal organic precursors, one channe1 for water and a plasma head.

System Overview

Hardware Details

• Single open-loop vacuum chamber with heated table and heated sidewalls
• 8.25" Heated table can run 80-300ºC
• Downstream 300 W RF plasma head with isolation valve
• Software to run loops of dose/purge cycles to enable ALD

Substrate Requirements

• 8.25" Diameter circular, flat table.
• Substrates must be able to handle 100-250C heating depending on process.
• Due to aggressive pumping/purging very small samples or powders not recommended.
• 208V, 3Ph, 60Hz, 25A

Para Tech LabTop 3000 Compact Bench Top Parylene Conformal Coating System. The compact LabTop by Para Tech is designed for coating small substrates and modules in laboratory, R&D and short run production settings. Its 8” by 9” stainless steel chamber can also accommodate larger devices for prototyping and research and development applications. Features the same automated process features and vacuum coating precision as full size Para Tech coating systems. Ideal for application development as well as short run production coating of printed circuit boards, medical components, electronic sensors and other small substrates. Tangential entry and exit of the polymerizing monomer results in an extremely low coating thickness gradient as well as superior film uniformity. Produces very thin Parylene film for optical applications and microwave components.  CE compliant.

Pfeiffer TPH 180HU Turbo Pump With TCP 380 Controller and Cables. DN 100 ISO-K Flange, 180L/S Pumping Speed, 100-240V, 50/60Hz.7 Available

Plasmatherm SLR ICP Shuttle Lock ICP Inductively Coupled Plasma Etch System. PC controller. Vacuum load lock with wafer transfer robot. Can process wafers from 2” to 8” depending on which process kit is installed. Currently configured with 4” kit.  High frequency RF-based inductively coupled plasma source capable of high density plasma generation. Closed loop pressure control. Turbo pump with roughing pump. Total of eight MFC gas controllers. Includes water chiller and roughing pump. 208V, 3Ph, 60Hz

Polycold PFC-550LT Fast Cycle Water Vapor Cryochiller. The Polycold Fast Cycle Water Vapor Cryochillers (PFC) effectively captures water vapor, which comprises 65% to 95% of the residual gas in high-vacuum systems. Water vapor is typically the most reactive contaminant present. With the PFC cryochillers, you can expect to increase product throughput in your existing system 20% to 100% and improve quality of deposition. Sold AS IS with no refrigeration charge.

Polycold PFC-660-HC Fast Cycle Water Vapor Cryochiller. The Polycold Fast Cycle Water Vapor Cryochillers (PFC) effectively captures water vapor, which comprises 65% to 95% of the residual gas in high-vacuum systems. Water vapor is typically the most reactive contaminant present. With the PFC cryochillers, you can expect to increase product throughput in your existing system 20% to 100% and improve quality of deposition. Sold AS IS with no refrigeration charge.

PVA TEPLA 660 Microwave Plasma Cleaning System. Low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation. The electrode-free energy feeding is the key factor for processing substrates in their original, unslotted magazines. Microwaves of 2.45 GHz are simply applied through a window in the wall of the vacuum chamber producing a largely extended plasma there. Unslotted magazines are processed in a downstream configuration, slotted magazines are more properly placed on a rotating platform. Any size of magazine can be processed. Due to the use of microwaves the plasma systems 400 and 660 provide for fast and damage-free plasma processing. In these plasma systems the plasma cleaning effect is based on chemical reactions of reactive plasma particles (radicals) guided through the substrate carriers. The systems are easy to operate and feature simpliest loading and unloading, manually as well as automatically. System software complies with standards in semiconductor industries. Currently configured with three gas inputs plus purge gas. Chamber size 15" x 15" x 15". System comes with rotary vane vacuum pump.

PVA TEPLA ION 100 Plasma Treatment System.

Features Include:

• Plug and play self installation
• Flexible electrodes
• Industrial computer with LCD touch panel and keyboard.
• Windows based operating system.
• Graphical User Interface (GUI) software complies with
• CFR Title 21 Part 11 and Semi E95-1101
• Multi-level user access
• Software
  • Recipe editor for fast and versatile step controls
  • Onboard diagnostic features and alarm logging
  • Remote process monitoring via Ethernet
  • Online web based simulation/training/support
• Pump power outlet on the chassis
• Energy saving feature—pump control

TYPICAL APPLICATIONS:

• Surface cleaning
• Surface activation
• Surface functionalization
• Deposition of siloxane and organic thin films

Technical Data

Process Chamber

Material: Aluminum
Dimension: 375 mm W x 762 mm D x 375 mm H
(14.75”x30”x14.75”)
Volume: 107 L (3.78 ft3)
Electrodes: 7 Shelf- each shelf 12.5" x 24.5"
Number of MFCs: 3
Process Pressure: (0.16 to 2.66) mbar
(120 to 2000) mTorr
Base Pressure: 0.07 mbar (50 mTorr)
Pumping Time: 1 min (Pump dependent)
Loading: Manual

Plasma Generator Frequency/power: 13.56 MHz/1000 W

230V, 3Ph, 50/60Hz

RETSCH Safety Jar Clamp for grinding jars 250 ml. 

RETSCH Aerated Cover "C", for grinding jar 250 ml, zirconium oxide. Made from durable zirconium oxide, it is resistant to wear and corrosion, ensuring a long lifespan even under demanding conditions. 2 Available.