Used Baron Blakeslee MVR-444LE SMH-10

EDC 100 Exclusive Design Co. Rigid Disk Cleaning System. Uses brushes and surfactant to scrub disks. LCD display. Analog control of scrub/rinse speed and spin dry speed. 115V, 60 Hz.

UVOCS T10X10-OES Ultra Violet Ozone Cleaning System. UV/Ozone cleaning process provides a simple, inexpensive, fast method of obtaining ultra-clean surfaces free of organic contaminants on most inorganic surfaces, such as quartz, silicon, gold, nickel, aluminum, gallium, arsenide, alumina†, etc.  The process is ideal when thin film deposition with excellent adhesion to the substrate is required.  Ultra-clean surfaces can easily be achieved by UV/Ozone processing in one to several minutes after the substrate has been cleaned by conventional techniques. Active Area: 100” squared. Sliding parts tray height to 1.5”. Lamp units 245nm UV. Digital controller. 115V, 60 Hz, 2.5A

UVP PR-100 Ozone Surface Cleaner A photochemical interaction occurs in an atmosphere of ultraviolet radiation and ambient air that generates ozone. As the molecules of an organic contaminant become active under ultraviolet radiation they dissociate. The organic contaminants then decompose into harmless volatile gases such as carbon dioxide. The PR-100 produces surfaces meticulously free of contamination. Chamber: 111/8” x 11 5/8” x 3 1/8”.

Semitool STI 870 Spin Rinser Dryer Double Stack. 6” Wafer Rotor in the top spinner and a 4" Rotor in the bottom spinner. High performance cleaning, rinsing and drying system for 25 wafer batch cassette. This system is capable of cleaning substrates from 2” to 6” round if the correct Rotor is installed for that wafer size. On axis orientation keeps wafers parallel allowing DI water manifolds to spray both sides of product continuously and simultaneously. Built in resistivity monitor. 120V, 50/60 Hz,

Semitool STI ST 260 Spin Rinser Dryer. High performance cleaning, rinsing and drying system for 25 wafer batch cassette. Currently configured with Rotor for 2” wafers. This system is capable of cleaning substrates from 2” to 5” round if the correct Rotor is installed for that wafer size. On axis orientation keeps wafers parallel allowing DI water manifolds to spray both sides of product continuously and simultaneously. Built in resistivity monitor. 120V, 50/60 Hz,

UVOCS T16X16/OES Ultraviolet Ozone Cleaning System. Cleaning or oxidation with the UVOCS is accomplished by the combination of ultraviolet light and ozone.  Low pressure quartz-mercury vapor lamp which generates UV emissions in the 254 and 185 nanometer range.  Source Size: 16” x 16”. Active Area: 256 sq. in. Width: 20”. Depth: 29¾”. Height: 14½ ”. 110 V, 60 Hz, 5.0A

Jelight 144AX UV Ozone Cleaner. UVO cleaning method is a photo-sensitized oxidation process in which the contaminant molecules of photoresists, resins, human skin oils, cleaning solvent residues, silicone oils and flux are excited and/or dissociated by the absorption of short wavelength UV radiation. Tray Size: 12” x 12” x 3”. 120V, 60 Hz, 5A. CE

OEM Group 470S SRD High Performance Spin Rinse Dryer Wafer Cleaner. The SRD is a 25 wafer, batch size, single or dual chamber tool. This proven design has demonstrated uptime of 95%. Introduced in 1979, over 25,000 SRD units have shipped worldwide. Spray on axis orientation allows uniform spray onto the wafers. Clean / Rinse built-in resistivity monitoring assures an automatic and reliable clean; the process chamber is cleaned with the product; quick ramp S model brushless DC motor provides economy and efficiency. Dry centrifugal drying, coupled with heated nitrogen and a lowpressure nitrogen purge through a heated process chamber. Flexible Fast easy to change rotors for simple re-configuration to match any array of applications’ wafers. Currently configured with single bolt rotor for 6" x 6" squares. 120V, 50/60Hz, 15A

Semitool Single Bolt SRD Rotor. Model A189-60-25. One unit available configured for 6" x 6" Squares and one for 5.5" x 6" squares. Price is $250 each.

UVOCS T10X10-OES Ultra Violet Ozone Cleaning System. UV/Ozone cleaning process provides a simple, inexpensive, fast method of obtaining ultra-clean surfaces free of organic contaminants on most inorganic surfaces, such as quartz, silicon, gold, nickel, aluminum, gallium, arsenide, alumina†, etc.  The process is ideal when thin film deposition with excellent adhesion to the substrate is required.  Ultra-clean surfaces can easily be achieved by UV/Ozone processing in one to several minutes after the substrate has been cleaned by conventional techniques. Active Area: 100” squared. Sliding parts tray height to 1.5”. Lamp units 245nm UV. Digital controller. 115V, 60 Hz, 2.5A