Used West Bond 454647E-79

Bid Service > Bonders - Welders >

Equipment Photos

454647E-79

Equipment Details

Inventory Number: 65042
Category: Bonders - Welders
Manufacturer: West Bond
WEST BOND 454647E-79 Semiautomatic Convertible Ball Wire Bonder

Microprocessor controlled motor drives for both Y and Z-axes bond a succession of parallel, 

single or multiple arched wires maintaining identical loop and bond shapes. 

Unlimited deep-reach access to bond targets on IC packages of any X-Y dimension with West•Bond’s

throatless chassis and micromanipulator designs.

Ideal for bonding high power, high frequency devices where identical bond and loop shapes are

critical.Bonder comes with only a ball bonding head.  

All machine configuration constants and bonding parameters are programmable at the machine panel. 

LCD display. 

Heated work holder with digital display.  

Three axis micromanipulator with entire mechanism above the work plane. 

115V, 50/60 Hz, 6A.
Now (USD): $18,000.00

Products Similar to: West Bond 454647E-79

Used Avio PHU-10

Inventory Number: 52634
Now (USD): $950.00

Avio PHU-10 Pulse Heating Power Supply with NT-5A Transformer.

Product Details

Used Leko L930U

Inventory Number: 60373
Now (USD): $3,500.00

Leko L930U Pulse Heat Alignment and Bonding TAB/FPC onto TFT/LCD. LCD repair machine. Connect TAB/FPC onto TFT/ LCD. Soft soldering technics to connect FPC FFC onto PCB: Connect single core axes onto plugs. Applied to seal LCD modules in cell phones, electronic translators, PDA, digital cameras, pins of computers.Precise temperature control system. PLC to multi-point control the operation of the machine. Collocate one or two sets of high precision CCD systems. Standard Size of Bonding Blade: 60x2 (mm) MAX. Camera: White and Black /color 1/3 interface. Temp. Range: Room temperature to 400 deg C +/-1 deg C. Time Range: 0.1S - 999H +/-0.1S.  Pressure Range: 0.15 - 0.5 Mpa. Heat Up Time: 100 - 300 deg C 4 - 8S.

Product Details

Used Hypervision Chip Unzip

Inventory Number: 48882
Now (USD): $3,500.00

Hypervision Chip Unzip Backside Preparation System. Low stress backside preparation system is useful for the development and analysis of flip-chips, lead-on-chips packaging and advanced chip design with more than 3 metallization layers. Software controlled milling to remove semiconductor packaging materials: epoxy molding compound, ceramic, metal and perform backside thinning on silicon die.

Product Details

Used Benchmark System 2000

Inventory Number: 61894
Now (USD): $500.00

Benchmark System 2000 Seam Sealer Package Welder. As Is, only what is in photo. No power supply or computer.

Product Details

Used West Bond 7372B

Inventory Number: 63226
Now (USD): $8,500.00

West Bond 7372B Convertible Epoxy & Eutectic Die Bonder. Simple change of a tool head allows for use as either epoxy or eutectic die bonder. With pick-up tool rotation and radiant heat. Microprocessor controller with LCD display. StereoZoom microscope.

Product Details

Used K&S 4524

Inventory Number: 64238
Now (USD): $12,950.00

K&S 4524 Manual Gold Ball Bonder. Versatile production capabilities for bonding applications from simple to discrete devices up to complex hybrid, microwave devices. Built-in programmable negative electronic flame-off system provides ball size fine control and consistency. Does not have Heated work holder. Must purchase separately. Digital logic controls all machine functions, including ball size and tail length. StereoZoom microscope. 115V, 50/60 Hz, 4A, CE. Includes fiber optic spotlight target and lighting option.

Product Details

Used Branson SW-200

Inventory Number: 64551
Now (USD): $9,500.00

Branson SW-200 Spin Welder. The Branson SW200 is a precision servo-driven spin welding system capable of welding circular parts with accurate control. It is easy to set up and operate. The SW200 is designed for use in manual, semi-automated, or fully-automated environments. A free-standing operator interface allows for the following adjustments: revolutions per minute (RPM), revolutions per cycle (RPC), and hold time (HT). Adjustable RPC (revolutions per weldcycle). This provides for consistent weld results. Rapid deceleration provides high-strength bonds. Adjustable hold time. Adjustable height (18"/457 mm) andstroke (up to 3.5"/89 mm) provide ease of setup. 208V, 1Ph, 60Hz, 20A

Product Details

Used K&S 4522

Inventory Number: 64719
Now (USD): $13,950.00

K&S 4522 Manual Gold Ball Wire Bonder With heated work holder. For process development, production, research or added manufacturing support. Provides the high yield and excellent repeatability needed. Consistent ball size via negative electronic flame-off. Missing ball detection and auto-stop. Consistent tail length with fine adjustment on operator panel. Phase Locked Loop (PLL) ultrasonic generator and high-Q transducer.115V, 50/60Hz, 4A

Product Details

Used K&S 4524

Inventory Number: 64725
Now (USD): $12,950.00

K&S 4524 Manual Gold Ball Bonder. Versatile production capabilities for bonding applications from simple to discrete devices up to complex hybrid, microwave devices. Built-in programmable negative electronic flame-off system provides ball size fine control and consistency. Includes Heated specimen work holder. Digital logic controls all machine functions, including ball size and tail length. StereoZoom microscope. Includes fiber optic spotlight target and lighting option. 115V, 50/60 Hz, 4A, CE.

Product Details

Used Dage 4000-BS5KG-R

Inventory Number: 64794
Now (USD): $2,500.00

Dage 4000-BS5KG-R Ball Shear 5KG Load Cell with Rotation. Tested Good.

Product Details