West Bond

West Bond 7372B Convertible Epoxy & Eutectic Die Bonder. Simple change of a tool head allows for use as either epoxy or eutectic die bonder. With pick-up tool rotation and radiant heat. Microprocessor controller with LCD display. StereoZoom microscope.

West Bond 4KE Semi-Automatic, Motorized Y/Z Axes, Wedge-Wedge, Ball-Wedge Convertible Wire Bonder. Series 4KE models are three-way convertible Semi-Automatic wire bonders of a gantry design. The entire mechanism is arrayed above the work plane, so that it is wide open to accommodate different size and style of work packages. Two-axes X and Y are driven manually by unique West·Bond micro-manipulator for positioning. Microprocessor controlled W (in Y direction) and Z axes are driven by program controlled motors to arch the connection. It is capable of creating a series of parallel, single or multiple arched wires while maintaining identical loop and bond shapes. Cross roller bearings rigidly guided axes are moving orthogonally, with independent pneumatic brakes in X and Y applied on signal. Target the critical bond location manually with the manipulator via moving the crosshairs generated on the screen and image captured from vertical view CCTV camera, then the target will be secured by the brakes to proceed with programmed bonding. A dual force mechanism, operated pneumatically, acts to change between two pre-set force values, and either high or low force may be programmed for any bond. Radiant tool heat with panel mounted, controlled by constant current. With simple exchange of clamp assemblies, bond tool, and wire path provided with the software mode will allow quick conversion between conventional 45º wire feed, deep access wire or ribbon, ball bonding, insulated wire and single point tab / lead bonding. All programmed bond variables as well as machine settings for each bond mode are retained in the machines memory. Bond Force: 10 – 150 grams; (High / Low programmable). Au / Al: 0.7 to 3 mil, Ribbon: 0.5x2 to 1x10 mil, Au Ball Bonding: 0.7 to 2 mil. 115V, 50/60Hz, 3.2A

West Bond 7700E-79 Thermosonic Ball to Wedge Wire Bonder. Wire Bonder Bonds gold wires ranging from 0.0007” to 0.002”. Three-axis manual micromanipulator, entire mechanism arrayed above the work plane, so there is no limit to size of work piece. All machine configuration constants and bond settings are programmable, prompted by a series of screens. Heated work holder with digital control. 115V, 50/60 Hz, 10A

West Bond 4KEX Semi-Automatic, Motorized Y/Z Axes, Wedge-Wedge, Ball-Wedge Convertible Large Substrate Wire Bonder. Series 4KE models are three-way convertible Semi-Automatic wire bonders of a gantry design. The entire mechanism is arrayed above the work plane, so that it is wide open to accommodate different size and style of work packages. Two-axes X and Y are driven manually by unique West·Bond micro-manipulator for positioning. Microprocessor controlled W (in Y direction) and Z axes are driven by program controlled motors to arch the connection. It is capable of creating a series of parallel, single or multiple arched wires while maintaining identical loop and bond shapes. Cross roller bearings rigidly guided axes are moving orthogonally, with independent pneumatic brakes in X and Y applied on signal. Target the critical bond location manually with the manipulator via moving the crosshairs generated on the screen and image captured from vertical view CCTV camera, then the target will be secured by the brakes to proceed with programmed bonding. A dual force mechanism, operated pneumatically, acts to change between two pre-set force values, and either high or low force may be programmed for any bond. Radiant tool heat with panel mounted, controlled by constant current. With simple exchange of clamp assemblies, bond tool, and wire path provided with the software mode will allow quick conversion between conventional 45º wire feed, deep access wire or ribbon, ball bonding, insulated wire and single point tab / lead bonding. All programmed bond variables as well as machine settings for each bond mode are retained in the machines memory. Bond Force: 10 – 150 grams; (High / Low programmable). Au / Al: 0.7 to 3 mil, Ribbon: 0.5x2 to 1x10 mil, Au Ball Bonding: 0.7 to 2 mil. This unit has a larger 20" x 20" work platform and a 6" x 8" heated work holder. Can do large substrates or small standard size sustrates. 115V, 50/60Hz, 3.2A

West Bond 353637E-90 Automatic, Gantry, Large Area, Triple-Convertible Wire Bonder. Currently configured for Wedge Bonding. Model 353637E is a gantry with overhead ways and a moving bond head that brings the bonding function to the work and leaves the material handling process flow under customer control. It uses the full 2400B Series software to locate and bond automatically fine wire connections arrayed over a large, stationary work piece. There is no limit to the size of the work as this machine is entirely above the bond plane. The area traversed for bonding is five and three-eights by nine and one-half inches for all bond methods. The wedge-wedge bonding method accepts aluminum wire, or gold wire with work piece heat. The primary wire feed method through angled clamps can be converted by exchange of clamp assemblies to vertical-feed wedge bonding for deep-walled work packages. This machine is intended to bond groups of parallel wires on work pieces pre-aligned for front-to-back bonding. Quality expectation is high with missing wire detection that functions without work contact, and with on-screen presentation of bond progress via a second, side-view camera.