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Kurt J. Lesker

Used Kurt J. Lesker SL0150MVCF

Inventory Number: 60046
Now (USD): $150.00

Manual Vacuum Valve. 2-3/4 in. OD conflat flange.

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Used Kurt J. Lesker Vacuum Chamber

Inventory Number: 61477
Now (USD): $1,250.00

Vacuum Chamber. Was used as a sputtering chamber on a cluster type deposition system. Originally a single target sputter up unit. Overall Outside Chamber Dimensions: 45 in. L x 24 in. W x 9 in. H. Not including flanges. System Height: 61 in.

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Used Kurt J. Lesker PVD 75

Inventory Number: 62448
Now (USD): $39,000.00

Low Temperature Evaporator Thin Film Deposition System. Low temperature evaporator (LTE) deposits volatile organic materials for thin film formation for organic material based devices. Crystal film thickness monitor. Quartz substrate heaters for substrate temperature control. 12-inch substrate holder with rotation control. Turbo pumped vacuum system with dry scroll pump roughing. Low temperature source controller with two LTE organic sources. Touch screen controller on door. Chamber Dimensions: 14 in. W x 14 in. D x 24 in. H.

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Used Kurt J. Lesker PVD 75

Inventory Number: 62732
Now (USD): $79,000.00

Thin Film Deposition Tool Sputtering and Thermal Evaporation In One Compact Tool. Great laboratory tool with DC sputtering and multisource thermal evaporation in the same tool. Easy to use graphical user interface. Two 3-inch DC magnetron cathodes with variable gap and angle. Three thermal sources. RF bias substrate plasma cleaning option. Unit has heater controls and feedthroughs but no heater element. Advanced Energy Pinnacle Plus pulsed DC magnetron power supply. Two gas inputs controlled by MFC. Substrate rotation motor. Crystal deposition rate monitor. Turbo pump and roughing pump. 208V, 60 Hz, 3 Ph. Date of Mfg.: 8-2013.

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Used Kurt J. Lesker CMS-18

Inventory Number: 63009
Now (USD): Contact for Price

Six Target Load Locked RF DC Sputtering System. Dual chamber with load lock. Three cathodes in each chamber for total of six cathodes. PLC Process control (programmable depositions). Substrates up to 8 in. dia. Substrate rotation. Substrate bias, RF and DC. Substrate heater up to 500 deg C. 3-inch Magnetron sputter cathodes. Process Gases: Ar, O2, N2. RF and DC power supplies. CALL FOR PRICE.

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