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Suss Microtec

Used Suss Microtec MJB4

Inventory Number: 61271
Now (USD): $59,000.00

Suss Microtec MJB4 Precision Mask Aligner and UV Exposure System. Ideal, economical tool for laboratories and small series production. In its contact exposure modes, the equipment can achieve a resolution of 0.5 μm, a performance unsurpassed in any other comparable machine. Widely used for MEMS and optoelectronics applications. It is specially configured for handling nonstandard substrates such as hybrids, high-frequency components or fragile III-V materials such as GaAs or InP. Equipped with SUSS Splitfield microscope enabling fast and highly accurate alignment. The MJB4 is equipped with a XY Theta alignment stage using high precision, backlash-free micrometer spindles for X, Y and Theta. The travel range for X and Y is +/-5mm, for Theta +/-5 degrees. Substrate thickness compensation is easily adjustable allowing for a shift-free separation/contact movement. The manual Z-movement allows a maximum substrate thickness of up to 4mm. Features and Benefits: Wafer and substrate handling up to dia. 100mm (wafers), 4 in. x 4 in. (substrates). Currently configured with 3 in. chuck. High precision X,Y, Theta alignment stage and microscope manipulator. Ergonomic operation. Touch panel graphical user interface. Printing Modes: UV400: Soft Contact 2.0 micrometers. Hard Contact 1.0 micrometers. Vacuum Contact less than 0.8 micrometers. UV300: Soft Contact 2.0 micrometers. Hard Contact 1.0 micrometers. Vacuum Contact less than 0.6 micrometers.

Product Details

Used Suss Microtec PH150

Inventory Number: 62936
Now (USD): $1,500.00

Suss Microtec PH150 Precision Magnetic Base Probe Manipulator. X-Y-Z travel. Magnetic base.

Product Details

Used Suss Microtec MJB4

Inventory Number: 60960
Now (USD): $59,000.00

Suss Microtec MJB4 Precision Mask Aligner and UV Exposure System. Ideal, economical tool for laboratories and small series production. In its contact exposure modes, the equipment can achieve a resolution of 0.5 micrometers, a performance unsurpassed in any other comparable machine. Widely used for MEMS and optoelectronics applications. It is specially configured for handling nonstandard substrates such as hybrids, high-frequency components or fragile III-V materials such as GaAs or InP. Equipped with SUSS Splitfield microscope enabling fast and highly accurate alignment. Features and Benefits: Wafer and substrate handling up to dia. 100mm (wafers), 4 in. x 4 in. (substrates). Currently configured with 3 in. chuck. High precision X,Y, Theta alignment stage and microscope manipulator. Ergonomic operation. Touch panel graphical user interface. Printing Modes: UV400: Soft Contact 2.0 micrometers. Hard Contact 1.0 micrometers.  Vacuum Contact less than 0.8 micrometers. UV300: Soft Contact 2.0 micormeters. Hard Contact 1.0 micrometers. Vacuum Contact less than 0.6 micrometers. The MJB4 is equipped with a XY Theta alignment stage using high precision, backlash-free micrometer spindles for X, Y and Theta. The travel range for X and Y is +/-5mm, for Theta +/-5 degrees. Substrate thickness compensation is easily adjustable allowing for a shift-free separation/contact movement. The manual Z-movement allows a maximum substrate thickness of up to 4mm.

Product Details