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Semiconductor Equipment Corp.

Used Semiconductor Equipment Corp. 410

Inventory Number: 52745
Now (USD): $29,000.00

Flip Chip Die Bonder. Aligns and attaches flip chip die onto various substrates. Versatile processing capabilities allow for tacking die in place for subsequent reflow or for complete attachment on the heated work stage. Comes with only one die tray holder. Motorized Stage Travel: 6 in. Computer controlled 350 deg C heated stage. Cube beam splitter alignment. Die Size: 0.010 to 1.000 in. sq.

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Used Semiconductor Equipment Corp. 4461

Inventory Number: 45172
Now (USD): $2,500.00

Hot Shot Sweep SMD Rework Station. Removes and replaces all SMD’s quickly and easily without changing nozzles. Video aided pickup and placement system. Built in PC control.

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Used Semiconductor Equipment Corp. KTM 83A

Inventory Number: 62253
Now (USD): $950.00

Pick and Place System. Missing plate that holds the wafer. Sold As Is incomplete.

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Used Semiconductor Equipment Corp. 410X

Inventory Number: 52615
Now (USD): $10,000.00

Flip Chip Die Bonder. Aligns and attaches flip chip die onto various substrates. Granite table with granite risers. Alignment accuracy is +/- 5 microns. PC controller. Sold As Is.

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