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Semiconductor Equipment Corp.

Used Semiconductor Equipment Corp. 410

Inventory Number: 52745
Now (USD): $29,000.00

Semiconductor Equipment Corp. 410 Flip Chip Die Bonder. Aligns and attaches flip chip die onto various substrates. Versatile processing capabilities allow for tacking die in place for subsequent reflow or for complete attachment on the heated work stage. Comes with only one die tray holder. Motorized Stage Travel: 6 in. Computer controlled 350 deg C heated stage. Cube beam splitter alignment. Die Size: 0.010 to 1.000 in. sq.

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Used Semiconductor Equipment Corp. KTM 83A

Inventory Number: 62253
Now (USD): $950.00

Pick and Place System. Missing plate that holds the wafer. Sold As Is incomplete.

Product Details