New Arrivals

CTI Cryotorr 8 Cryo pump. Needs rebuild. Sold As is

AITEC AR-SV3G-100 Wafer Transfer Robot. Was used in a vacuum cluster tool. No cables or controllers.

Alessi REL-4500 150mm Manual Analytical Wafer Prober. Vacuum Chuck: 6” dia. (150mm). Manual XY stage movement: 6” X x 6” Y.  Platen accepts vacuum or magnetic base probe manipulators. Mitutoyo microscope with single long working distance objective. Manual quick lift platen.

Allied High Tech Metprep 4 Polisher with PH-4 Power Head and Ad-5 Fluid Dispenser. The MetPrep 4™ grinding and polishing machines, with PH ™ power heads, are powerful systems for semiautomatic operation, ideal for low to high volume sample preparation requirements. Intuitive menu navigation with user-friendly touchpad interface and backlit LCD make the machines easy to use and program. The microprocessor based system allows up to 25 programmable steps, including parameters for platen speed, comp/contra rotation (sample holder/platen), cycle time, fluid selection, sample force (LbF or N), sample rotation speed, water rinse and force reduction (on/off, %). A "Procedure Development" mode allows in-process adjustments to platen speed, sample force and sample rotation speed to determine optimum parameters. Jog mode enables convenient variable speed platen rotation without activating the power head to allow initial charging of cloths or manual grinding/polishing. Either standard or magnetic 10"/254 mm or 12"/305 mm platens may be used with any plain/adhesive backed or magnetic system disc.

Features:
• Touchpad switches to control all functions
• Backlit 4-line LCD
• Sturdy aluminum and stainless steel
construction
• Variable platen and jog speed in 10 RPM
increments
• Variable cycle time: 0-120 minutes
(15 second increments)
• Seamless integration with optional AD-5 ™
Fluid Dispenser for automatic operation
• Overflow diversion to protect internal
components
• Quick-change platen design, anodized to
resist wear and corrosion
• Electronic coolant control with adjustable
flow control valve
• Bowl flush to prevent debris buildup
• Emergency shut-off switch
• compliant for EU

Includes Optional Recirculating Filtration System inside the optional polisher Stand. Also includes a sample holder for 4 1" mounts.

Includes AD-5 ™ fluid dispenser provides automatic, unattended application of abrasive polishing suspensions and lubricants.

115V, 50/60Hz

LIKE NEW CONDITION. Hardly Used! MFG 07/2022

Allwin21 Accuthermo AW610 Rapid Thermal Processor.

The AccuThermo AW610 is a rapid thermal processing (RTP) system, which uses high intensity visible radiation to heat single wafers for short process periods of time at precisely controlled temperatures. The process periods are typically 1‑600 seconds in duration, although periods of up to 9999 seconds can be selected. The AccuThermo RTP AW610M rapid thermal annealing system consists of an oven unit and a controller computer running the Allwin21 RTAPRO controller software. The wafer to be processed is placed on a quartz tray that slides into a quartz isolation tube in the oven unit. Four banks of lamps, two above the quartz tube and two below it, provide the source of energy for heating the wafer. The lamps can be controlled manually and automatically from the controller computer. The RTAPRO control software allows full control and diagnostics of the AccuThermo RTP system.  In addition, it allows the creation of recipes for automated control of the temperature and, optionally, process gas flow. The control software uses a set of operating instructions known as recipes to automatically control the AccuThermo RTP system. These recipes are created by the Process Engineer to monitor and control the parameters of the processing cycle. The Operator then uses the software to select and run the process parameters (steady state temperature, process time, ramp rates, etc.).

HEATPULSE 610 Features

Manually loaded and capable of processing silicon and III-V substrates up to 150mm in diameter, Heatpulse 610 provides solutions to your process development and monitoring needs. Equipped with a graphical user interface to improve operator productivity, Heatpulse 610 offers recipe management and system diagnostics.

HEATPULSE 610 Major System Features

• Semiconductor grade quartz process chamber
• 21 tungsten halogen lamps in an upper and lower array
• Extended Range Pyrometer: 400°C -1300oC (200°C w/TC)
• Graphical User Interface(GUI)

These capabilities, combined with the heating chamber’s cold-wall design and superior heating uniformity, provide significant advantages over conventional furnace processing.

HEATPULSE 610 Key Features Include

• Closed-loop temperature control with pyrometer or thermocouple temperature sensing.
• Precise time-temperature profiles tailored to suit specific process requirements.
• Fast heating and cooling rates unobtainable in conventional technologies.
• Consistent wafer-to-wafer process cycle repeatability.
• Elimination of external contamination.
• Small footprint and energy efficiency.

HEATPULSE 610 Performance Specifications

• Recommended Steady State Temperature Range: 400-1250° C.
• Steady-State Temperature Stability: ± 2° C.
• Temperature Monitoring Mechanisms: Extended Range Pyrometer (ERP), used throughout the recommended temperature range, or a thermocouple, used for process temperatures below 400° C.
• Heating Rate: 1-200° C per second, user-controllable.
• Cooling Rate: Temperature dependent; max 150° C per second.
• Maximum Non-uniformity:
• ±5°C across a 6″ (150mm) wafer at 1150°C. (This is a one sigma deviation 100 angstrom oxide.) For a titanium silicidation process, no more than 4% increase in non-uniformity during the first anneal at 650°C to 700 °C.
• Post-anneal sheet resistivity measured on a 150mm wafer annealed at 1100° C for 10 seconds. R&D models optimized for slip control.
• Implant: As 1E16 50 KeV with implant uniformity ≤0.3%
• Lamp Life: Unconditionally guaranteed for three years.
• Steady State Time: 1-9999 sec. (1-600 sec. recommended)
• Wafer Sizes for the HEATPULSE 610: 2″, 3″, 4″, 5″ and 6″.
• Process Gases: The HEATPULSE system delivers one non-corrosive process gas with manually controlled flow. Two process gas inputs installed.

ALLWIN21 ACCUTHERMO AW810M RTP Rapid Thermal Processing System. Date of MFG 09/2021. Very Light Use. The system uses high intensity visible radiation to heat single wafer for short process periods of time at precisely controlled temperatures. The process periods are typically 1-600 seconds in duration, although periods of up to 9999 seconds can be selected. These capabilities, combined with the heating chamber's cold-wall design and superior heating uniformity, provide significant advantages over conventional furnace processing.

AccuThermo AW 810 Software Key Features
o Integrated process control system
o Real time graphics display
o Real time process data acquisition, display, and analysis
o Programmed comprehensive calibration and diagnostic functions
o Closed-loop temperature control with temperature sensing.
o Precise time-temperature profiles tailored to suit specific process
requirements.
o Faster, easier Programmable comprehensive calibration of all
subsystems, leading to enhanced process results.
o A recipe editor to create and edit recipes to fully automate the
processing of wafers inside the AccuThermo RTP
o Validation of the recipe so improper control sequences will be
revealed.
o Storage of multiple recipes, process data and calibration files so that
process and calibration results can be maintained and compared over
time.
o Passwords provide security for the system, recipe editing, diagnostics,
calibration and setup functions.
o Simple and easy to use menu screen which allow a process cycle to be
easily defined and executed.
o Troubleshooting feature which allows engineers and service personnel
to activate individual subassemblies and functions. More I/O, AD/DA
“expose”.
o Use PowerSum technology to detect the process and increase Yield.
o Watchdog function: If this board looses communication with the control
software, it will shut down all processes and halt the system until
communication is restored.
o GEM/SECS II function (Optional).
AccuThermo AW 810 Specifications
 Wafer sizes: Small pieces, 2", 3", 4", 5", 6", 8" wafer capability-------CURRENTLY CONFIGURED WITH TRAY FOR 8" SQUARES.
 Recommended ramp up rate: Programmable, 10°C to 120°C per
second. Maximum Rate: 200°C (NOT RECOMMENDED)
 Recommended steady state duration: 0-300 seconds per step.
 Ramp down rate: Non-programmable, 10°C to 200°C per second.
 Recommended steady state temperature range: 150°C - 1150°C.
Maximum 1250°C (NOT RECOMMENDED)
 ERP Pyrometer 450-1250°C with ±1°C accuracy when calibrated against
an instrumented thermocouple wafer.
 Thermocouple 100-800°C with ±0.5°C accuracy & rapid response.
 Temperature repeatability: ±0.5°C or better at 1150°C wafer-to-wafer.
(Repetition specifications are based on a 100-wafer set.)
 Temperature uniformity: ±8°C across an 8" (200 mm) wafer at 1150°C.
(This is a one sigma deviation 100 angstrom oxide.) For a titanium
silicide process, no more than 6% increase in non-uniformity during the
first anneal at 650°C to 700°C.
 Process/Purge gas inputs: Any inert and/or non-toxic gas regulated to 30
PSIG and pre-filtered to 1 micron. Typically, N2, O2), Ar, He, forming gas,
NH3, N2O2 are used.---Currently configured with 2 MFC for gas inputs.

208V, 3Ph, 60Hz, 100A

A-TECH SYSTEMS Ion Milling System with Magnetron Sputtering Cathode. Research grade Ion milling system with a single Ion gun and a single 3" RF Magnetron Sputtering Cathode. Previously sputtered Titanium. System has a 4" diameter substrate holder with automated rotation and manual angle adjustment. Computer reads angle and speed. System is mostly manual with some computer interface, monitoring and menu selection. The chamber uses a turbo pump for high vacuum and a manual gate valve. There are MFC gas controllers, Ar 100 sccm, Ar 10 sccm, Kr 10 sccm, Xe 10 sccm.

ATM Systemlabor 3 Dual Wheel Polisher Grinder with Power Head. Electronic control with touch screen display. Power head applies precise down pressure to 6 position sample holder. Two 12" diameter polishing plates. Variable speed. 110V, 60Hz.

TV Technologie SRO 702 IR Vacuum Reflow Brazing RTA. The perfect soldering systems, solder reflow ovens (SRO) with rapid thermal annealing and brazing capability are IR lamp heated multi-purpose cold wall process ovens. The SRO is ideal for R&D, process development as well for low to high volume production. Die attachment, IGBT/DBC, high vacuum encapsulation, MEMS package sealing, IR sensor/Crystal package sealing, wafer level
packaging, thermo electric cooler/Peltier, low moisture package sealing, high power LED, laser bar, Getter activation, alloying, wafer bump/solder ball reflow, pin fin heat sink, backing, flip chip, 3 D-CSP, diffusion bonding, CPV, thermo compression bonding, pin fins, Hybrid assembly, MMIC die attachment, power modules, electric vehicle controls, power solar cells. Temperature: up to 1100°C.  Fast heated plate ramping. Ramping up >3.5°C/sec. Ramping down >    2°C/sec. Rapid single wafer processing >    50°C/sec.  Heated Area: 147 x 217mm. 208V, 3 Ph, 60 Hz, 25A, CE.