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Dicing Saws-Scribers

Used ADT Advanced Dicing Technologies 982-6

Inventory Number: 54731
Now (USD): $15,000.00

Precision Dicing Saw. Precision dicing, cutting and slotting for the semiconductor and microdevices industries. Process parameters are totally programmable through interactive menu-driven screens. 6 in. dia. vacuum chuck. Air bearing spindle with 2 in. dia blade and maximum speed of 40,000 rpm. Video viewing of alignment and cutting. Date of Mfg.: 9/2004.

Product Details

Used ADT Advanced Dicing Technologies 7100 ProFortis

Inventory Number: 60692
Now (USD): $39,000.00

Precision Dicing Saw with 4-inch Spindle for Hard Materials Processing. 4-inch, 2.5 kW front mount spindle with closed loop control 30,000 rpm max. Optimized for multi-panel dicing of thick and hard materials up to 200mm x 200mm with the highest level of precision such as glass, DWDM optical filters, thick ceramic, saw filters, glass/silicon sensors and P ZT. proFortis include standard features that allow dicing of tight-tolerance devices and panels that require extreme accuracy and a high level of process control. Direct-drive turntable with closed-loop control and 350 degrees rotation. In unison with Y-axis linear encoding, unwavering accuracy and parallelism are insured over long distances. LoadMonitor for real-time control. ADT exclusive LoadMonitor system utilizes direct feedback from the DC spindle motor to maintain spindle rpm. Real-time monitoring and control of spindle speed prevents chipping and insures cut quality. Vision System: Digital camera, Fire-Wire technology, bright LED illumination (vertical and oblique). Magnification from x60 to x240. Utilities: Electrical: 200-240V, 50/60 Hz, 1 Ph. Air: 350 L/min at 5.5 bar. Spindle Coolant: 1.1 L/min tap water. Cutting Water (DI/tap): Up to 7 L/min.

Product Details

Used Allied High Tech Model 4000

Inventory Number: 60750
Now (USD): $3,500.00

Precision Sectioning Saw. Sample capacity is up to 2.5 in. thick and 8 in. in length. Variable Speed: 100 to 4000 rpm. Recirculating coolant system. 3 in. to 8 in. blade capacity. 120V, 60 Hz.

Product Details

Used Aremco Accu-Cut 5200

Inventory Number: 61730
Now (USD): $6,500.00

Ultra Hard Material Dicing Saw. Used to cut a wide range of ultra-hard materials such as ceramics, ferrites and quartz, as well as semiconductor materials including silicon, gallium arsenide and bismuth telluride. The Accu-Cut Model 5200 is a compact, semiautomatic system for laboratory and production applications on substrates up to 4 in. x 4 in. x 3/4 in. thick. It comes equipped with a 5,000 rpm fixed speed spindle, a manual indexing Y-stage and an air/oil in-feed for maintaining smooth, precise stage control. Parts are mounted with a pneumatic vise or vacuum manifold to a 360° theta stage for part alignment, and a monocular microscope.

Product Details

Used Benetec Labcut 250F

Inventory Number: 61193
Now (USD): $8,500.00

Floor Model High Speed Abrasive Cutting Saw. Manually operated and designed for using up to a 250 mm/10-inch cutting wheel for the general work in materials laboratory. 208V, 3 Ph, 60 Hz, CE.

Product Details

Used Disco DAC-2SP/86

Inventory Number: 38633
Now (USD): $12,500.00

Automated Dicing Saw. Max. Substrate Size: 150 mm. Range of Indexing: 0.0001 to 99.9999 mm. Minimum Step Indexing: 0.00025 mm. Spindle Rotation: 3000 to 40,000 rpm. Older dicing saw but in good condition.

Product Details

Used Disco DAD522

Inventory Number: 58774
Now (USD): $17,000.00

Precision Automatic Wafer Dicing Saw. Extra-high precision automatic cutting saw for cutting materials such as silicon wafers, glass and small electronic parts made of ceramic. Work Piece Size: 152mm. Theta Axis Rotation: 380 degrees. Dual objective split image microscope. 1.5 kW Synchro Spindle™. Requires house air and water. 200V, 3 Ph, 50/60 Hz.

Product Details

Used Disco DAD341

Inventory Number: 61679
Now (USD): $21,500.00

Wafer Dicing Saw. For up to 8 in. wafers. Broken Blade Detector (BBD). 1000 Watt Synchro spindle. 8-inch Universal chuck table. Single objective microscope. Monitor.

Cutting Section - X-axis:
Max. Stroke Length: 445 mm.
Cutting Range: 326 mm. 163 mm areas on both the right and left hand sides of spindle center.
Working Width Setting Range: 0 in. to 8 in. (0 to 203.2 mm). Variable in 0.001 mm steps.
Travel Speed: Feed speed input range 0.1 to 400 mm/s. Return Speed: 400 mm/s.

Y-axis:
Slide/drive system. Max. Stroke Length: 210 mm.
Cutting Range: 210 mm. 105 mm areas on both the front and rear sides of table center.
Working Width Setting Range: 0 in. to 8 in. (0 to 203.2 mm). Variable in 0.0001 mm steps.

Index Setting Range - Input: 0.0001 to 210 mm (variable in 0.0001 mm steps). Speed: 25 mm/s.

Product Details

Used Dynatex DXE

Inventory Number: 61836
Now (USD): $750.00

Wafer and Substrate Expander. Fast cycle time for mounting tape onto hoop sets and expansion. Thermostatically controlled and fully adjustable heated platen optimizes expansion. No physical contact between wafer surface and expander. Max. Hoop Set: 6 in. Max. Wafer Size: 5 in. 115V, 50/60 Hz, 5A.

Product Details

Used K&S 984-6

Inventory Number: 56722
Now (USD): $21,500.00

Precision Dicing Saw for Hard Materials. 4 in. dicing technology for superior sawing. Automated process control. For cutting hard materials up to 6 in. dia. Sub-micron accuracy. 4 in. spindle. 208V, 1 Ph, 50/60 Hz, 15A.

Product Details