Inventory Number: 54731
Precision Dicing Saw. Precision dicing, cutting and slotting for the semiconductor and microdevices industries. Process parameters are totally programmable through interactive menu-driven screens. 6 in. dia. vacuum chuck. Air bearing spindle with 2 in. dia blade and maximum speed of 40,000 rpm. Video viewing of alignment and cutting. Date of Mfg.: 9/2004.
Inventory Number: 60692
Precision Dicing Saw with 4-inch Spindle for Hard Materials Processing. 4-inch, 2.5 kW front mount spindle with closed loop control 30,000 rpm max. Optimized for multi-panel dicing of thick and hard materials up to 200mm x 200mm with the highest level of precision such as glass, DWDM optical filters, thick ceramic, saw filters, glass/silicon sensors and P ZT. proFortis include standard features that allow dicing of tight-tolerance devices and panels that require extreme accuracy and a high level of process control. Direct-drive turntable with closed-loop control and 350 degrees rotation. In unison with Y-axis linear encoding, unwavering accuracy and parallelism are insured over long distances. LoadMonitor for real-time control. ADT exclusive LoadMonitor system utilizes direct feedback from the DC spindle motor to maintain spindle rpm. Real-time monitoring and control of spindle speed prevents chipping and insures cut quality. Vision System: Digital camera, Fire-Wire technology, bright LED illumination (vertical and oblique). Magnification from x60 to x240. Utilities: Electrical: 200-240V, 50/60 Hz, 1 Ph. Air: 350 L/min at 5.5 bar. Spindle Coolant: 1.1 L/min tap water. Cutting Water (DI/tap): Up to 7 L/min.
Inventory Number: 60750
Precision Sectioning Saw. Sample capacity is up to 2.5 in. thick and 8 in. in length. Variable Speed: 100 to 4000 rpm. Recirculating coolant system. 3 in. to 8 in. blade capacity. 120V, 60 Hz.
Inventory Number: 61193
Floor Model High Speed Abrasive Cutting Saw. Manually operated and designed for using up to a 250 mm/10-inch cutting wheel for the general work in materials laboratory. 208V, 3 Ph, 60 Hz, CE.
Inventory Number: 60862
Automatic Cut-Off Machine. Cutting power is provided by 7.5 h.p. motor driving a 14 in. abrasive cutting wheel. Capacity to handle solid metallic sections up to 4 in. dia. A sophisticated hydro/pneumatic system automatically controls the cutter feed and cutting force yielding a high quality cut every time. Requires 80 psi. Recirculating cooling system. 440V, 3 Ph, 60 Hz, 12.5A.
Inventory Number: 38633
Automated Dicing Saw. Max. Substrate Size: 150 mm. Range of Indexing: 0.0001 to 99.9999 mm. Minimum Step Indexing: 0.00025 mm. Spindle Rotation: 3000 to 40,000 rpm. Older dicing saw but in good condition.
Inventory Number: 58774
Precision Automatic Wafer Dicing Saw. Extra-high precision automatic cutting saw for cutting materials such as silicon wafers, glass and small electronic parts made of ceramic. Work Piece Size: 152mm. Theta Axis Rotation: 380 degrees. Dual objective split image microscope. 1.5 kW Synchro Spindle™. Requires house air and water. 200V, 3 Ph, 50/60 Hz.
Inventory Number: 61679
Wafer Dicing Saw. For up to 8 in. wafers. Broken Blade Detector (BBD). 1000 Watt Synchro spindle. 8-inch Universal chuck table. Single objective microscope. Monitor.
Cutting Section - X-axis:
Max. Stroke Length: 445 mm.
Cutting Range: 326 mm. 163 mm areas on both the right and left hand sides of spindle center.
Working Width Setting Range: 0 in. to 8 in. (0 to 203.2 mm). Variable in 0.001 mm steps.
Travel Speed: Feed speed input range 0.1 to 400 mm/s. Return Speed: 400 mm/s.
Slide/drive system. Max. Stroke Length: 210 mm.
Cutting Range: 210 mm. 105 mm areas on both the front and rear sides of table center.
Working Width Setting Range: 0 in. to 8 in. (0 to 203.2 mm). Variable in 0.0001 mm steps.
Index Setting Range - Input: 0.0001 to 210 mm (variable in 0.0001 mm steps). Speed: 25 mm/s.
Inventory Number: 55263
150mm Fully Programmable Scriber Breaker. Designed to increase yield and provide superior processing speeds. Windows operating environment provides a fast user friendly interface. Zero kerf loss allows higher die density on wafer. Fully programmable for all scribing and breaking parameters including TrueAngle diamond tool positioning. Currently configured for 6 in. dia. tape rings and up to 4 in. dia. wafers. Can be retooled to do up to 150mm wafers. 100-240V,1 Ph,50/60 Hz,10/5A,CE.
Inventory Number: 59037
Machine Type Bench Lathe. Speed control. Geared head. Center Height: 115mm. Distance between centers: 500mm. Max. Dia. over slide: 68mm. Spindle Speed: 130, 300, 400, 600, 1000, 2000 rev/min. 120V, 60 Hz.