Temescal FC-4400 E-Beam Evaporator Deposition System

Temescal FC-4400 E-Beam Evaporator Deposition System

The  FC-4400 represents Temescal`s ultimate high throughput
platform for lift-off orientated evaporation This system is designed
to support the metallization of up to 30 x 150mm wafers per load via
high-capacity e-beam evaporation.

The load locked, 44-inch x 44-inch x 28-inch product chamber is
pumped by two dedicated, high throughput 16-inch
cryogenic pumps. The dual-cryopump option makes it possible to
pump this large chamber in 15 minutes from atmosphere to pressures
in the range of 10E-7. During wafer exchanges, the source chamber is
maintained at high vacuum by the independent pumping of a dedicated
10-inch cryopump.

-Product chamber dimensions: 23.5" high x 44" x 44",
-25.5" diameter source tray

Temescal, the expert in metallization for the processing of Compound Semiconductor

based substrates, provides the best evaporation system available. Temescal systems provide

controlled multi-layer coatings of materials such as Ti, Pt, Ag, Al, Cr, Cu, Mo, Sn, SiO2 and ITO.

Repeatable uniformity and performance guaranteed.

System

• Production: 150 & 200mm
• Product Chamber Type: box
• Load Lock to isolate Product Chamber
• Cryopump water L/sec: 44,000
• Pump down time: 1E-06 < 10mins
• E-gun
• E-gun Power Supply:  12 kW
• Ion gun------------CAN BE INSTALLED AT ADDITIONAL COST.
• Max wafer count: Lift off 30x150mm,15x200MM-------No domes included.
• Source to Substrate: std 38″

TWO UNITS AVAILABLE