Modular Process Technology RTP-600XP Rapid Thermal Processing System

Modular Process Technology RTP-600XP Rapid Thermal Processing System

The integrated process control system features real time graphics,

recipe management, data acquisition and has a comprehensive diagnostic

function. Wafer size up to 6”. Temperature Range: 100°C to 800°C

with max steady-state typically around 800°C. Extended range pyrometer

can be added to increase the maximum temperature. Rapid heating and cooling

capabilities from 0°C up to 150°C per second using tungsten-halogen lamps.

Quartz chamber. Two MFC Gas inputs. Highly uniform loop

array with accurate control and monitoring.

208V, 3 Ph, 60 Hz, 100A.