Suss Microtec MJB4
Precision Mask Aligner and UV Exposure System
Ideal, economical tool for laboratories and small
series production. In its contact exposure modes,
the equipment can achieve a resolution of 0.5 μm, a
performance unsurpassed in any other comparable
machine. Widely used for MEMS and optoelectronics
applications. It is specially configured for handling
nonstandard substrates such as hybrids, high frequency
components or fragile III-V materials such as GaAs
or InP. Equipped with SUSS Split field microscope
enabling fast and highly accurate alignment.
The MJB4 is equipped with a XY Theta alignment
stage using high precision, backlash-free micrometer
spindles for X, Y and Theta. The travel range for X
and Y is +/-5mm, for Theta +/-5°. Substrate thickness
compensation is easily adjustable allowing for a
shift-free separation/contact movement. The manual
Z-movement allows a maximum substrate thickness
of up to 4mm.
Features and Benefits:
Wafer and substrate handling up to dia.
100mm (wafers), 4” x 4” (substrates).
High precision X, Y, Theta alignment
stage and microscope manipulator.
Ergonomic operation. Touch panel
graphical user interface.