Designed for cutting various types of materials with minimal sample deformation. Precision sectioning tool capable of cutting virtually any material. Easy to read liquid crystal display. Manual 1 micron sample positioning. Linear feed mechanism. User selectable feed rate allows even the most delicate samples to be cut without deformation. Blade Speed:200 to 5000 rpm. Wafer blade diameter from 3" to 8" capable. 120V, 50/60Hz, 1Ph, CE