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Tresky T-3000-HF High Force Flip Chip Bonder
Tresky T-3000-HF High Force Flip Chip Bonder
Tresky T-3000-HF High Force Flip Chip Bonder
Tresky T-3000-HF High Force Flip Chip Bonder
Tresky T-3000-HF High Force Flip Chip Bonder
Tresky T-3000-HF High Force Flip Chip Bonder
Tresky T-3000-HF High Force Flip Chip Bonder
Tresky T-3000-HF High Force Flip Chip Bonder
Tresky T-3000-HF High Force Flip Chip Bonder
Tresky T-3000-HF High Force Flip Chip Bonder
Tresky T-3000-HF High Force Flip Chip Bonder
Tresky T-3000-HF High Force Flip Chip Bonder
Tresky T-3000-HF High Force Flip Chip Bonder
Tresky T-3000-HF High Force Flip Chip Bonder
Tresky T-3000-HF High Force Flip Chip Bonder
Tresky T-3000-HF High Force Flip Chip Bonder
Tresky T-3000-HF High Force Flip Chip Bonder
Tresky T-3000-HF High Force Flip Chip Bonder
Tresky T-3000-HF High Force Flip Chip Bonder
Tresky T-3000-HF High Force Flip Chip Bonder

Tresky T-3000-HF High Force Flip Chip Bonder

  • $15,000.00
  • Will not ship until

Sku: 65242

Tresky T-3000-HF High Force Flip Chip Bonder

TRESKY T-3000-HF flip chip bonder is used for the epoxy dispensing and stamping, samples alignment (2 µm accuracy), heating and compression to enable interconnecting devices. The bonder is capable of 20 g to 50 kg pressure, 360° die spindle rotation range, 200 mm X and Y motion range. The system is equipped with tool and substrate heat up to 400 °C. Samples are aligned via HDMI camera.

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