Used Micro Point Pro Ibond 5000D Ball Bonder

Provides the High Yields and Excellent Repeatability Needed for All Gold Ball Bonding Applications Including:

• Optoelectronic modules
• Hybrid/MCMs
• Microwave products
• Discrete devices/lasers

Semi-Automatic/Manual Mode with ‘Z’ Option

‘Z’ Axis DC Servo Motion with Closed-Loop Control

Consistent Ball Size Via Negative Electronic Flame-Off

Missing Ball Detection & Auto-Stop

Deep Access Capability

Built-In Temperature Controller

Various Microscope and Spotlight Targeting Options Available

Large 6” x 6” Bonding Area

Variety of Wire Types: Gold & Copper (with copper kit option)

Chessman/Mouse & Manual ‘Z’ Convertible Right or Left

Ball Bonding, Bumping, Coining, Security Bond & Tab