{"product_id":"tresky-t-3000-hf-high-force-flip-chip-bonder","title":"Tresky T-3000-HF High Force Flip Chip Bonder","description":"\u003cp class=\"MsoNormal\"\u003e\u003cb\u003e\u003cspan style=\"font-size: 14.0pt; line-height: 115%; font-family: 'Times New Roman',serif; color: #212529; background: white;\"\u003eTresky T-3000-HF High Force Flip Chip Bonder\u003c\/span\u003e\u003c\/b\u003e\u003c\/p\u003e\n\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-family: 'Times New Roman',serif; color: #212529; background: white;\"\u003eTRESKY T-3000-HF flip chip bonder is used for the epoxy dispensing and stamping, samples alignment (2 µm accuracy), heating and compression to enable interconnecting devices. The bonder is capable of 20 g to 50 kg pressure, 360° die spindle rotation range, 200 mm X and Y motion range. The system is equipped with tool and substrate heat up to 400 °C. Samples are aligned via HDMI camera.\u003c\/span\u003e\u003cspan style=\"font-family: 'Times New Roman',serif;\"\u003e\u003c\/span\u003e\u003c\/p\u003e","brand":"Bidservice","offers":[{"title":"Default Title","offer_id":43319936548927,"sku":"65242","price":15000.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0598\/6245\/0239\/files\/65242.jpg?v=1780075740","url":"https:\/\/bidservice.com\/products\/tresky-t-3000-hf-high-force-flip-chip-bonder","provider":"Bidservice","version":"1.0","type":"link"}