Used Dymax PC-2

Pressure Converter Valve. Three position valve extends sampling pressure range. 2-3/4 in. O.D. conflat.

Used on Canon PLA-501 Series mask aligners.

Flexicure UV Adhesive Curing System. Developed to accelerate the curing process of UV adhesives for component bonding, sealing and protection. 2 outputs but only 1 flexible cable.

Mask Alignment and Exposure System. Split field alignment with twin video cameras equipped with zoom lenses. Controlled collimation exposures. Nitrogen purge. Proximity printing. Soft contact control. Currently configured with 3-3/8 in. x 3-3/8 in. vacuum chuck and 5 in. mask. Other sizes can be purchased from manufacturer. 500/1000W UV light source. 115V, 60 Hz.

Projection Mask Aligner. For thin film alignment and expose on ceramic, silicon, metal or glass substrates with diagonals or diameters of up to 6 in. Through-the-lens alignment. 4 to 8 mils depth of focus. 1:1 projection. 1000W lamp maximum. Wavelength Range: 350 to 450nm. Resolution: 15 to 25 microns.

Mask Aligner with Manual Substrate Handling. Contact or proximity mask aligner. Manual substrate loading of wafers, partial wafers, substrate and special material processing. Lamp housing and power supply capable of using UV lamps up to 1000W 365-400nm. Capable of exposing substrates up to 150mm with appropriate chuck and mask option. Currently configured for 4 in. dia. wafers. Sold As Is.

Weather Ometer Weather Resistance Tester. Self-contained precision laboratory instrument for determining the effects of strong light and water spray under closely controlled conditions of heat and humidity. Programmer enables the operator to select the desired periods of light, darkness and water spray. Very large specimen chamber. 230V, 3 Ph, 60 Hz, 52A. Date of Mfg.: July/2001.

Photospeed Tool Measures Batch to Batch Photospeed Variations. Photoresist testing system. Oriel part 83995 near UV system with fast shutter. Assures that exposure dosage is in-line with your process window requirements. No need to sideline your expensive stepper for photoresist testing. Provides accurate, incremented bulk area exposures across a wafer. Use it to quantify threshold exposure, spectra variations, find potential resist problems and verify lot to lot consistency.

Standard Mask Aligner. System capable of exposing partial wafers or substrates up to a maximum size of 3 in. dia. Ask salesperson about available chucks and sizes. Hard or soft contact modes. 365nm to 400nm spectrum of a 200W high pressure arc lamp. Alignment optics consist of normal field microscope with objective turret for different magnifications. 110V, 60 Hz.

Mask Aligner with Backside and Topside Alignment Capabilities. The scanning backside alignment is accomplished using an IR camera which detects infrared light transmitted through an IR transparent chuck, as well as the substrate and mask being aligned. Olympus microscope. The alignment microscope uses 5X, 10X, 20X and 50X objective lenses for either backside or topside alignment. For topside alignment the eyepieces are 10X. The exposure source is a 350W Hg lamp powered by a Suss Model CIC 500. The system incorporates UV-400 optics to transfer the energy to the substrate. The substrate may be exposed in soft or hard contact with both forms of alignment. Also in topside alignment the vacuum contact (high precision“HP”) is available. Wavelength: 365nm, 405nm. 115-230V, 50/60 Hz. Very Nice Condition.