Used Nanometrics 8300X

Automated Defect Inspection System. Inspection of whole wafers, sawn wafers, JEDEC trays, Auer boats, die in gel/waffle paks, MCM’s. Detects defects down to 0.5 micron. Automated wafer mapping and identification. Automated data collection and reporting. Menu-based, easy to use Windows environment. 200-240V, 1 Ph, 50/60 Hz, 5A, CE. Sold As Is.

Non-Contact Profile Measurement System. Uses laser triangulation to analyze two dimensional data. Non-contact measurement allows you to work with wet and fragile samples. PC controller analyzes data. Motorized stage. 120V, 60 Hz.

Bump Measurement Profiling System. The right inspection tool for flip-chip process control. Repeatably measures solder bump heights, from 150 micro-meters or more for standard flip-chip bumps down to a few microns for under-bump metalization pads, as well as provides volume data on all bump sizes. Non-contact 3-D data on all size bumps over the entire wafer. The system calculates bump height, width, volume and coplanarity. Automatically detects bump position, solder bridges, and missing and extra solder bumps, with prominent display of pass/fail results and position statistics at the bump, die,wafer and lot level. Powerful measurement analysis, generating output as 2-D cross sections, contour plots, bearing ratio plots, or 3-D images. A built in Wizard allows quick measurement set-up. Sold As Is.

Multimode Scanning Probe Microscope. The Magnascope SXM300 is a multimode probe microscope that measures sub-micron features to near angstrom-level resolution. It is designed for critical-dimension measurements of height, width, roughness and sidewall angles of 300mm wafers and masks of up to 9 in x 9 in. Sold As Is.

Maxim 3D Laser Interferometric Microscope. PARTS SYSTEM.

Variable Angle Broadband Spectroscopic Ellipsometer. Ellipsometer for complicated film stacks, mapping film thickness and optical properties. Has PMT detector. Wavelength: 250nm to 850nm. User friendly Windows® based interface. SOPRA ellipsometer that had been serviced by Angstrom Sun Technologies. Allows for variable angle broadband spectroscopic ellipsometry. Motorized 8 in. stage for 3D sample plots. Camera with zoom lens.

Noncontact Profiler. Sold As Is untested for parts or a project machine. We have not powered the system. Two objectives: IX50 and IX5.

Multiwavelength 200mm Ellipsometer. Has a software disk but no cables or controls. Missing computer and stage driver. Two wavelength ellipsometers use additional laser sources to analyze difficult films. 8 in. dia. stage with motorized stage, no controller. Sold As Is with 30 day ROR.

Non-Contact Automatic 3-Axis Tabletop Measurement System. JMAR Video CMM® software. Supports high magnification microscope optics. Three channel computer controlled light source. X-Y stage travel: 10 in. x 4 in. 115V, 60 Hz. Mfg. 2001.

Automated Film Thickness Measurement System. Tabletop film thickness measurement and mapping tool. Designed to measure the thickness of films deposited on various substrates including those used in semiconductor and magnetic head fabrication. Uses non-contact spectroreflectometry on sites as small as 10 micrometers. A computer sample stage and a robust autofocus system allows the automatic generation of film thickness uniformity maps. 115V, 50/60 Hz, 5A.