Bid Service, LLC 225 Willow Brook Rd. Freehold, NJ 07728
Phone: 732-863-9500Email: [email protected]
Travel Arrangements Google Maps
Vimeo HD Equipment Videos
Bid Service YouTube Channel
ION TECH MPS 5001 ION Gun With Power Supply. Ion gun with power supply. Gun grid 8.5" diameter and the outside flange is approximately 20". We can't test the unit but it comes with a 30 day right to return.
March Instruments PX 1000E8 Plasma Asher/Etcher with Pneumatic Vertical Door. Batch system for plasma cleaning or etching. Currently configured with vertical shelves: 18 in. x 6 in. RFX 600 13.56 MHz RF generator. Two gas inputs. Does not include vacuum pump at this price, additional cost depending on type required. Shelves are mounted vertically from top to bottom. Not standard horizontal mounting.
Anatech SP100 Table Top Plasma System. For plasma cleaning of small parts or for modifying surfaces. Digital countdown timer. Analog pressure display. Gas flow with needle valve control. RF Power Source: 100W at 13.56 MHz. Quartz Chamber: 4 in. x 8 in. Includes vacuum pump. 110V, 60 Hz, 10A.
Plasmatherm SLR-720/720 Dual Chamber RIE Reactive Ion Etch System. PC controller with graphical user interface. Dual chamber unit with robot loader. Was lasted used to process 4" wafers. RF5S 500W, 13.56 MHz RF Generator. Comes with a Turbo pump but does not come with roughing pump. Currently confi gured with nine MFC. 208V, 3 Ph, 60 Hz. Sold as is where is untested at this price.
PVA TEPLA 660 Microwave Plasma Cleaning System. Low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation. The electrode-free energy feeding is the key factor for processing substrates in their original, unslotted magazines. Microwaves of 2.45 GHz are simply applied through a window in the wall of the vacuum chamber producing a largely extended plasma there. Unslotted magazines are processed in a downstream configuration, slotted magazines are more properly placed on a rotating platform. Any size of magazine can be processed. Due to the use of microwaves the plasma systems 400 and 660 provide for fast and damage-free plasma processing. In these plasma systems the plasma cleaning effect is based on chemical reactions of reactive plasma particles (radicals) guided through the substrate carriers. The systems are easy to operate and feature simpliest loading and unloading, manually as well as automatically. System software complies with standards in semiconductor industries. Currently configured with three gas inputs plus purge gas. Chamber size 15" x 15" x 15". System comes with rotary vane vacuum pump.
PVA TEPLA ION 100 Plasma Treatment System.
Material: Aluminum Dimension: 375 mm W x 762 mm D x 375 mm H (14.75”x30”x14.75”) Volume: 107 L (3.78 ft3) Electrodes: 7 Shelf- each shelf 12.5" x 24.5" Number of MFCs: 3 Process Pressure: (0.16 to 2.66) mbar (120 to 2000) mTorr Base Pressure: 0.07 mbar (50 mTorr) Pumping Time: 1 min (Pump dependent) Loading: Manual
Plasma Generator Frequency/power: 13.56 MHz/1000 W
230V, 3Ph, 50/60Hz
Plasmatherm SLR ICP Shuttle Lock ICP Inductively Coupled Plasma Etch System. PC controller. Vacuum load lock with wafer transfer robot. Can process wafers from 2” to 8” depending on which process kit is installed. Currently configured with 4” kit. High frequency RF-based inductively coupled plasma source capable of high density plasma generation. Closed loop pressure control. Turbo pump with roughing pump. Total of eight MFC gas controllers. Includes water chiller and roughing pump. 208V, 3Ph, 60Hz
Ion Tech B58 Power Supply. Voltage limit for 1000V F.S.D. Current limit control for 2.5A F.S.D. RF type output connector. 110V, 60 Hz.
ION TECH MPS-5001 ION BEAM POWER SUPPLY. Item came from a customers spare parts we purchased. We can't test the unit but we are offering a 30 day right to return if it does not work for your process. 208/240V, 1Ph, 50/60Hz, 20A