Used Benetec Labcut 250F

Automated Dicing Saw. Max. Substrate Size: 150 mm. Range of Indexing: 0.0001 to 99.9999 mm. Minimum Step Indexing: 0.00025 mm. Spindle Rotation: 3000 to 40,000 rpm. Older dicing saw but in good condition.

Hard Material Dicing Saw. Diamond wheel cuts material on a 6 in. dia. vacuum chuck. Digital readout of X and Y axis. Manual control of index. Motorized cut feed. 200/220V, 3 Ph, 60 Hz.

Precision Dicing Saw for Hard Materials. 4 in. dicing technology for superior sawing. Automated process control. For cutting hard materials up to 6 in. dia. Sub-micron accuracy. 4 in. spindle. 208V, 1 Ph, 50/60 Hz, 15A.

984 Dicing Saw 4 inch Spindle. Rebuilt.

Precision Wafer Dicing Saw. Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield. Up to 200mm x 200mm work area, 6 in. dia. porous vacuum chuck currently installed. Z Axis Travel: 50mm. Blade Capacity: 2 in. to 3 in. Spindle speed programmable up to 60,000 rpm. 200/240V, 1 Ph, 50/60 Hz, 15A.

Precision Automatic Wafer Dicing Saw. Extra-high precision automatic cutting saw for cutting materials such as silicon wafers, glass and small electronic parts made of ceramic. Work Piece Size: 152mm. Theta Axis Rotation: 380 degrees. Dual objective split image microscope. 1.5 kW Synchro Spindle™. Requires house air and water. 200V, 3 Ph, 50/60 Hz.

Dicing System. Unparalleled machine rigidity, a unique overarm spindle support. Three layers of vibration isolation, Windows™ based CNC controls. For dicing silicon, gallium arsenide, glass, ceramics and other brittle materials. 2 in. air bearing spindle up to 40,000 rpm. 6 in. dia. vacuum chuck. 208V, 3 Ph, 50/60 Hz.

Precision Dicing Saw. Precision dicing, cutting and slotting for the semiconductor and microdevices industries. Process parameters are totally programmable through interactive menu-driven screens. 6 in. dia. vacuum chuck. Air bearing spindle with 2 in. dia blade and maximum speed of 40,000 rpm. Video viewing of alignment and cutting. Date of Mfg.: 9/2004.

Die Matrix Expander. Temperature controlled, heated wafer ram. 3-inch stroke with speed control and adjustable stroke stop. Consistent repeatability of expansion. Compact tabletop configuration. Adjustable preheat time. Ultron Systems Model UH 130 Die Matrix Expander increases throughput and yield through gentle die separation. The expander presents the die in an evenly spaced matrix to facilitate retrieval for pick and place or die attach. Streets remain parallel resulting in better die presentation.

Precision Wafer Dicing Saw. Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield. Up to 200mm x 200mm work area, 6 in. dia. porous vacuum chuck currently installed. Z Axis Travel: 50mm. Blade Capacity: 2 in. to 3 in. Spindle speed programmable up to 60,000 rpm. 200/240V, 1 Ph, 50/60 Hz, 15A.