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Equipment Details

Inventory Number: 62792
Category: Dicing Saws-Scribers
Manufacturer: Dynatex

Dynatex DXB DXB 120 Series Wafer Bonder. The DXB 120 is used for process development and small scale production. With its larger heated vacuum chamber the DXB 120 supports larger wafers. Heated Vacuum Chamber: 11.25 in. dia. On board timer is used to set the bonding process duration. Temp. Range: 100-320 deg F (40-160 deg C). Cycle Time Range: 1 sec - 10 min. Power: 100/120 VAC, 10A, 50/60 Hz. Vacuum Required: 18-25 inHg. Used for mounting wafer substrate. Improves bond quality and repeatability while improving process time during lapping, polishing and dicing.

Now (USD): $6,500.00

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