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PVA Tepla

Used PVA Tepla PS-210

Inventory Number: 60348
Now (USD): $27,500.00

Microwave Plasma Surface Treatment Etch System. The Microwave Plasma System 210 is ideal for: Plasma surface modification. Plasma cleaning of organic surfaces. Bond strength enhancement. Plasma etch applications. Plasma asher applications. Increased or decreased wettability. Any other plasma system application. Controller: Windows® O/S based touchscreen interface offering fully automatic control. Multi-step recipes, real time graphic display, multi-level password access, data logging, and real time SPC monitoring of all plasma parameters is provided. Microwave Power. Display: Color 10.4-inch touch screen for control and monitoring of process parameters, automatic recipes, or manual plasma treatments. Quartz Chamber: 9.5 in. dia. x 9 in. Four process gas inputs.  Previous Gases Used: O2, CF4, N2, AR. Includes vacuum pump. 230V, 1 Ph, 50/60 Hz, CE.

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Used PVA Tepla M4L

Inventory Number: 60416
Now (USD): $25,000.00

Plasma Etching System. Three gas five shelves. Shelf Size: 11.25 in. L x 13 in. W. The M4L is ideal for:  Plasma surface modification, Plasma cleaning of organic surfaces, Bond strength enhancement, Plasma etch applications. Plasma asher applications. The entire bench top system fits in one cabinet, except for the vacuum pump. Controller: Windows® O/S based touch screen interface offering fully automatic control. Multi-step recipes, real time graphic display, multi-level password access, data logging, and real time SPC monitoring of all plasma parameters is provided.

Product Details

Used PVA Tepla 660

Inventory Number: 62184
Now (USD): $35,000.00

Microwave Plasma Cleaning System. Low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation. The electrode-free energy feeding is the key factor for processing substrates in their original, unslotted magazines. Microwaves of 2.45 GHz are simply applied through a window in the wall of the vacuum chamber producing a largely extended plasma there. Unslotted magazines are processed in a downstream configuration, slotted magazines are more properly placed on a rotating platform. Any size of magazine can be processed. Fast and damage free plasma processing. Rotating stage inside chamber for even plasma cleaning. Three MFC controlled process gas inputs and one vent gas input. Includes oil free dry pump. Year of Mfg.: 2008.

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