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Plasma Etchers - Ashers - Ion Mills

Used Plasmatherm 790 MF

Inventory Number: 60293
Now (USD): $49,000.00

Plasmatherm 790 MF Plasma RIE Reactive Ion Etch System. PC controlled plasma etching system. Single process chamber with shower head style gas input and a 7 in. dia. platen. 500W, 13.56 MHz RF generator. Five MFC gas flow channels, previous gases used: HC-23, N2, 02, SF6. Roughing pump with blower. Does not include water chiller.

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Used Plasmatherm SLR-770 ICP

Inventory Number: 62603
Now (USD): $110,000.00

Plasmatherm SLR-770 ICP Shuttle Lock ICP Inductively Coupled Plasma Etch System. PC controller. Vacuum load lock with wafer transfer robot. Can process wafers from 2 in. to 8 in. depending on which process kit is installed. Currently configured with 3 in. kit. Thermal transfer module for effective cooling of substrate utilizing helium backside thermal transfer in conjunction with computer controlled substrate clamping. High frequency RF-based inductively coupled plasma source capable of high density plasma generation. Closed loop pressure control. Turbo pump with roughing pump. Total of eight MFC gas controllers. Previous gases used N2, O2, CHF3, AR, CH4, CL2, BCL3, CF4. Includes water chiller.

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Used PVA Tepla PS-210

Inventory Number: 60348
Now (USD): $27,500.00

PVA Tepla PS-210 Microwave Plasma Surface Treatment Etch System. The Microwave Plasma System 210 is ideal for: Plasma surface modification. Plasma cleaning of organic surfaces. Bond strength enhancement. Plasma etch applications. Plasma asher applications. Increased or decreased wettability. Any other plasma system application. Controller: Windows® O/S based touchscreen interface offering fully automatic control. Multi-step recipes, real time graphic display, multi-level password access, data logging, and real time SPC monitoring of all plasma parameters is provided. Microwave Power. Display: Color 10.4-inch touch screen for control and monitoring of process parameters, automatic recipes, or manual plasma treatments. Quartz Chamber: 9.5 in. dia. x 9 in. Four process gas inputs.  Previous Gases Used: O2, CF4, N2, AR. Includes vacuum pump. 230V, 1 Ph, 50/60 Hz, CE.

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Used PVA Tepla 660

Inventory Number: 62184
Now (USD): $35,000.00

PVA Tepla 660 Microwave Plasma Cleaning System. Low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation. The electrode-free energy feeding is the key factor for processing substrates in their original, unslotted magazines. Microwaves of 2.45 GHz are simply applied through a window in the wall of the vacuum chamber producing a largely extended plasma there. Unslotted magazines are processed in a downstream configuration, slotted magazines are more properly placed on a rotating platform. Any size of magazine can be processed. Fast and damage free plasma processing. Rotating stage inside chamber for even plasma cleaning. Three MFC controlled process gas inputs and one vent gas input. Includes oil free dry pump. Year of Mfg.: 2008.

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Used Technics PE II-A

Inventory Number: 63470
Now (USD): $1,000.00

Technics PE II-A RIE Etcher Spare Parts.

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Used Tegal 803

Inventory Number: 36279
Now (USD): $750.00

Tegal 803 Inline Automatic Plasma Etcher. The Plasma Inline 803 is a fully automatic, microprocessor-based plasma chemistry etcher designed especially for the etching of silicon dioxide (Si02) thin film deposited on single crystal or polysilicon semiconductor wafers. It provides up to four process gases, two process channels and a clean channel. Sold As Is. Does not come with monitor or RF generator.

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Used Tepla America PlasmaPen

Inventory Number: 63046
Now (USD): $9,500.00

Tepla America PlasmaPen Atmospheric High Density Plasma Cleaning/Etching System. Self contained unit that operates at atmospheric pressure. High density plasma, broad material application capability. Width of Treatment Band: 3-10 mm. Small blemish on front panel. 120V, 1 Ph, 60 Hz, 8A, CE.

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Used Trion Technology Minilock

Inventory Number: 56453
Now (USD): $9,500.00

Trion Technology Minilock Single Wafer RIE Etcher. LCD display. Load lock with transfer arm. Current substrate carrier for up to 150mm wafers. Five MFC for gas input. Missing RF generator and vacuum pump. Sold As Is.

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Used Trion Technology Phantom II

Inventory Number: 57573
Now (USD): $39,000.00

Trion Technology Phantom II ICP Inductively Coupled Plasma Etch System. For applications requiring a downstream, high density plasma source. Allows for higher plasma densities at lower pressures. Tight anisotropy in high aspect ratio structures and reduces microloading effect. Four MFC gas inputs mounted in seperate cabinet. Two RFX-600 13.56 MHz RF generators. 200mm substrate chuck.

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Used Trion Technology Sirus T2

Inventory Number: 63054
Now (USD): $32,000.00

Trion Technology Sirus T2 Tabletop RIE Reactive Ion Etcher. Plasma etching system designed to etch dielectrics and other films that require fluorine-based chemistries. Processes have been developed for etching silicon, silicon dioxide, silicon nitride, quartz, polyimide, tantalum, tungsten and other materials. Small footprint and robust design make it ideal for the lab environment. Good profile control, high sensitivity and good uniformity. 200mm bottom electrode. PC interface with touchscreen. Four MFC gas inputs, previous gases used AR, SF6, O2, CF4. Automatic tuning with 13.56 MHz 600W RF generator. Automatic pressure control package. Includes recirculating chiller. Turbo pump and roughing pump included. Endpoint detection in photo can be added at additional price. Year of Mfg.: 2011. Very Nice Condition.

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