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Plasma Etchers - Ashers - Ion Mills

Used Oxford Instruments Plasmalab 80 Plus RIE

Inventory Number: 62752
Now (USD): $15,000.00

Plasma System.  RF matching network mounted on top of chamber. ENI ACG-3 13.56 MHz 300W RF generator. 6-inch diameter platen. Does not include vacuum pump. 208V, 3 Ph, 50/60 Hz, CE. Sold As Is.

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Used Plasmatherm 790 6-inch RIE

Inventory Number: 55594
Now (USD): Contact for Price

THIS UNIT IS SOLD. WE WOULD LIKE TO BUY YOUR PLASMA THERM SYSTEMS. PLEASE CONTACT US IF YOU HAVE SYSTEMS TO SELL. * * * * * * * * * * * * * * * * * * * * * * * * * * Reactive Ion Etcher. Computer controlled plasma processing tool. Substrate electrode 7 in. dia. holds a 6 in. wafer. Shower head gas introduction. 500W, 13.56 MHz RF generator. Turbo pumped vacuum system. Includes roughing pump. 7 gas inputs controlled via MFC. 208V, 3 Ph, 60 Hz.

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Used Plasmatherm SLR 770/770MF

Inventory Number: 58792
Now (USD): $90,000.00

Load Locked Dual Chamber Plasma Etching System. One chamber configured for RIE and the other for ECR. PC controller with graphical user interface. System was refurbished in 2012 and installed at customer site. Unit never went into production due to facility closing. Leasing company selling to recoup costs. Missing the Leybold 1000C turbo pump. $90,000 or best offer. Sold Untested As Is.

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Used Plasmatherm 790 MF

Inventory Number: 60293
Now (USD): $49,000.00

Plasma RIE Reactive Ion Etch System. PC controlled plasma etching system. Single process chamber with shower head style gas input and a 7 in. dia. platen. 500W, 13.56 MHz RF generator. Five MFC gas flow channels, previous gases used: HC-23, N2, 02, SF6. Roughing pump with blower. Does not include water chiller.

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Used Plasmatherm SLR-770 ICP

Inventory Number: 62603
Now (USD): $110,000.00

Shuttle Lock ICP Inductively Coupled Plasma Etch System. PC controller. Vacuum load lock with wafer transfer robot. Can process wafers from 2 in. to 8 in. depending on which process kit is installed. Currently configured with 3 in. kit. Thermal transfer module for effective cooling of substrate utilizing helium backside thermal transfer in conjunction with computer controlled substrate clamping. High frequency RF-based inductively coupled plasma source capable of high density plasma generation. Closed loop pressure control. Turbo pump with roughing pump. Total of eight MFC gas controllers. Previous gases used N2, O2, CHF3, AR, CH4, CL2, BCL3, CF4. Includes water chiller.

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Used PVA Tepla PS-210

Inventory Number: 60348
Now (USD): $27,500.00

Microwave Plasma Surface Treatment Etch System. The Microwave Plasma System 210 is ideal for: Plasma surface modification. Plasma cleaning of organic surfaces. Bond strength enhancement. Plasma etch applications. Plasma asher applications. Increased or decreased wettability. Any other plasma system application. Controller: Windows® O/S based touchscreen interface offering fully automatic control. Multi-step recipes, real time graphic display, multi-level password access, data logging, and real time SPC monitoring of all plasma parameters is provided. Microwave Power. Display: Color 10.4-inch touch screen for control and monitoring of process parameters, automatic recipes, or manual plasma treatments. Quartz Chamber: 9.5 in. dia. x 9 in. Four process gas inputs.  Previous Gases Used: O2, CF4, N2, AR. Includes vacuum pump. 230V, 1 Ph, 50/60 Hz, CE.

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Used PVA Tepla M4L

Inventory Number: 60416
Now (USD): $25,000.00

Plasma Etching System. Three gas five shelves. Shelf Size: 11.25 in. L x 13 in. W. The M4L is ideal for:  Plasma surface modification, Plasma cleaning of organic surfaces, Bond strength enhancement, Plasma etch applications. Plasma asher applications. The entire bench top system fits in one cabinet, except for the vacuum pump. Controller: Windows® O/S based touch screen interface offering fully automatic control. Multi-step recipes, real time graphic display, multi-level password access, data logging, and real time SPC monitoring of all plasma parameters is provided.

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Used PVA Tepla 660

Inventory Number: 62184
Now (USD): $35,000.00

Microwave Plasma Cleaning System. Low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation. The electrode-free energy feeding is the key factor for processing substrates in their original, unslotted magazines. Microwaves of 2.45 GHz are simply applied through a window in the wall of the vacuum chamber producing a largely extended plasma there. Unslotted magazines are processed in a downstream configuration, slotted magazines are more properly placed on a rotating platform. Any size of magazine can be processed. Fast and damage free plasma processing. Rotating stage inside chamber for even plasma cleaning. Three MFC controlled process gas inputs and one vent gas input. Includes oil free dry pump. Year of Mfg.: 2008.

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Used SEZ Semiconductor Equipment MCM 203

Inventory Number: 61603
Now (USD): $25,000.00

Single Wafer Wet Chemical Spin Processor. Single wafer spin processor for yield improvement in wafer surface preparation. Manual loading and unloading of wafers, does not have cassette option. Used in semiconductor production and R&D applications of wafers to 200mm dia. Graphical user interface, PC controller. A maximum of sixteen process steps can be defined within one process file. Heat exchanger for controlling chemical temperature. Single process chemical tank. 208V, 50/60 Hz, 13A.

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Used SSEC 3302

Inventory Number: 62969
Now (USD): $59,000.00

Single Wafer Chemical Etch Processor. Two wafer processing modules, acid processing. Stainless steel construction. Two wafer elevators. PC controller. 220V, 3 Ph, 60 Hz, 30A, CE. Sold Untested.

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