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Plasma Etchers - Ashers - Ion Mills

Used Oxford Instruments 80 Plus RIE

Inventory Number: 57562
Now (USD): $59,000.00

Compact Plasma Reactive Ion Etching System RIE. The vacuum chamber is configured for optimal gas conductance at the wafer thus maximizing etch rate and uniformity. All parameters controlled via front panel display. 9 in. dia. platen. Previously used with four MFC and gases used were CF4, O2, CHF3, AR. Does not have turbo pump option installed. Includes vacuum pump. 208V, 3 Ph, 60 Hz.

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Used Oxford Instruments Plasmalab 800 Plus RIE

Inventory Number: 60811
Now (USD): $110,000.00

Large Capacity Open Loaded Reactive Ion Etching System. PC controller provides intuitive user interaction with the system via advanced graphics and process recipe pages. Footprint is kept to a minimum by locating all electronics and vacuum components within the body of the tool. Mass flow controllers are housed separately in a wall mounted gas pod. Four MFC gas controllers, previous gases O2, CF4, Ar, CHF3. A 460mm dia. electrode ideally suited for batch processes or single wafer processes with excellent uniformity across chamber. 18.75 in. dia. top electrode with shower head gas delivery. Vacuum system includes turbo pump and dry pump. Mfg. 2010, nice condition.

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Used Plasmatherm 790 6-inch RIE

Inventory Number: 55594
Now (USD): Contact for Price

THIS UNIT IS SOLD. WE WOULD LIKE TO BUY YOUR PLASMA THERM SYSTEMS. PLEASE CONTACT US IF YOU HAVE SYSTEMS TO SELL. * * * * * * * * * * * * * * * * * * * * * * * * * * Reactive Ion Etcher. Computer controlled plasma processing tool. Substrate electrode 7 in. dia. holds a 6 in. wafer. Shower head gas introduction. 500W, 13.56 MHz RF generator. Turbo pumped vacuum system. Includes roughing pump. 7 gas inputs controlled via MFC. 208V, 3 Ph, 60 Hz.

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Used Plasmatherm SLR 720 MF

Inventory Number: 58579
Now (USD): $59,000.00

RIE Reactive Ion Etch System. PC controller with graphical user interface. Single chamber unit with load lock. RF5S 500W, 13.56 MHz RF Generator. Turbo pump with roughing pump. Currently configured with four MFC, others may be added at additional price. 208V, 3 Ph, 60 Hz.

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Used Plasmatherm SLR 770/770MF

Inventory Number: 58792
Now (USD): $90,000.00

Load Locked Dual Chamber Plasma Etching System. One chamber configured for RIE and the other for ECR. PC controller with graphical user interface. System was refurbished in 2012 and installed at customer site. Unit never went into production due to facility closing. Leasing company selling to recoup costs. Missing the Leybold 1000C turbo pump. $90,000 or best offer. Sold Untested As Is.

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Used Plasmatherm 790 MF

Inventory Number: 60293
Now (USD): $49,000.00

Plasma RIE Reactive Ion Etch System. PC controlled plasma etching system. Single process chamber with shower head style gas input and a 7 in. dia. platen. 500W, 13.56 MHz RF generator. Five MFC gas flow channels, previous gases used: HC-23, N2, 02, SF6. Roughing pump with blower. Does not include water chiller.

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Used Plasmatherm 790 6-inch RIE

Inventory Number: 60479
Now (USD): $42,500.00

Single Chamber Plasma RIE Reactive Ion Etching System. Plasma Therm plasma processing system for single substrates up to 150mm dia. Parallel plate plasma processing with shower head gas delivery system. Six MFC gas channels. Previous Gases: AR, N2, O2, SF6, CHF3, CF4. Easy menu driven process programming. Turbo pumped vacuum system with roughing pump. 500W 13.56 MHz RF generator with matching network.

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Used PVA Tepla PS-210

Inventory Number: 60348
Now (USD): $35,000.00

Microwave Plasma Surface Treatment Etch System. The Microwave Plasma System 210 is ideal for: Plasma surface modification. Plasma cleaning of organic surfaces. Bond strength enhancement. Plasma etch applications. Plasma asher applications. Increased or decreased wettability. Any other plasma system application.

Controller: Windows® O/S based touchscreen interface offering fully automatic control. Multi-step recipes, real time graphic display, multi-level password access, data logging, and real time SPC monitoring of all plasma parameters is provided. Microwave Power. Display: Color 10.4-inch touch screen for control and monitoring of process parameters, automatic recipes, or manual plasma treatments.

Quartz Chamber: 9.5 in. dia. x 9 in. Four process gas inputs.  Previous Gases Used: O2, CF4, N2, AR. Includes vacuum pump. 230V, 1 Ph, 50/60 Hz, CE.

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Used PVA Tepla M4L

Inventory Number: 60416
Now (USD): $25,000.00

Plasma Etching System. Three gas five shelves. Shelf Size: 11.25 in. L x 13 in. W. The M4L is ideal for:  Plasma surface modification, Plasma cleaning of organic surfaces, Bond strength enhancement, Plasma etch applications. Plasma asher applications. The entire bench top system fits in one cabinet, except for the vacuum pump. Controller: Windows® O/S based touch screen interface offering fully automatic control. Multi-step recipes, real time graphic display, multi-level password access, data logging, and real time SPC monitoring of all plasma parameters is provided.

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Used PVA Tepla 660

Inventory Number: 62184
Now (USD): $35,000.00

Microwave Plasma Cleaning System. Low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation. The electrode-free energy feeding is the key factor for processing substrates in their original, unslotted magazines. Microwaves of 2.45 GHz are simply applied through a window in the wall of the vacuum chamber producing a largely extended plasma there. Unslotted magazines are processed in a downstream configuration, slotted magazines are more properly placed on a rotating platform. Any size of magazine can be processed. Fast and damage free plasma processing. Rotating stage inside chamber for even plasma cleaning. Three MFC controlled process gas inputs and one vent gas input. Includes oil free dry pump. Year of Mfg.: 2008.

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