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Dicing Saws-Scribers

Used K&S 7100 ADHM

Inventory Number: 60629
Now (USD): $29,000.00

Precision Dicing Saw Suitable for Hard Materials. Windows based operating system. 4 in. spindle programmable to 30,000 rpm. Blade Size: 4 in. to 5 in. 6 in. dia. porous vacuum chuck. Indexing Axis Resolution: 0.2 micrometers. 200-240V, 1 Ph, 50/60 Hz, 15A.

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Used K&S 7100 AD

Inventory Number: 60659
Now (USD): $25,000.00

Precision Wafer Dicing Saw. Monitor and control dicing stability via immediate feedback of blade load for greater precision and yield. Up to 200mm x 200mm work area, 6 in. dia. porous vacuum chuck currently installed. Z Axis Travel: 50mm. Blade Capacity: 2 in. to 3 in. Spindle speed programmable up to 60,000 rpm. 200/240V, 1 Ph, 50/60 Hz, 15A.

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Used K&S 982-6

Inventory Number: 61275
Now (USD): $15,000.00

Precision Dicing Saw. Precision dicing, cutting and slotting for the semiconductor and microdevices industries. Process parameters are totally programmable through interactive menu-driven screens. 6-inch dia. vacuum chuck. Air bearing spindle with 2-inch dia blade and maximum speed of 40,000 rpm. Video viewing of alignment and cutting.

Product Details

Used K&S 982-6

Inventory Number: 55022
Now (USD): $15,000.00

Precision Dicing Saw. Precision dicing, cutting and slotting for the semiconductor and microdevices industries. Process parameters are totally programmable through interactive menu-driven screens. 6-inch dia. vacuum chuck. Air bearing spindle with 2-inch dia. blade and maximum speed of 40,000 rpm. Video viewing of alignment and cutting.

Product Details

Used Lintec RAD-2500F/8

Inventory Number: 62399
Now (USD): $49,000.00

Fully Automatic Wafer Tape Frame Mounter. Consists of alignment function and tape tension control system which reduces voids at lamination. Currently configured for 200mm wafer size. 8-inch frame table (DTF2-8-1 Disco). Ring frame, heater spec. 6-inch VN wafer and 6-inch wafer cassette compliance. Protrusion sensor. 200-230V, 1 Ph, 50/60 Hz, 8A. Date of Mfg.: 2011.

Product Details

Used Loomis LSD-100

Inventory Number: 53881
Now (USD): Contact for Price

THIS UNIT IS SOLD. WE WOULD LIKE TO BUY YOUR LOOMIS SYSTEMS. PLEASE CONTACT US IF YOU HAVE SYSTEMS TO SELL. * * * * * * * * * * * * * * * * * * * * * * * * * * Precision Scriber Breaker. Roller style breaker. Motorized X-Axis control, 0.5 micron positioning resolution. Motorized rotation control. 4 in. wafer capability. Windows® operating system. Color camera. 100/240V, 1 Ph, 50/60 Hz.

Product Details

Used Micro Automation M3600

Inventory Number: 39015
Now (USD): $3,250.00

Tape Frame Applicator with Camera and Monitor for Alignment. Vacuum hold down of wafers up to 6 in. dia. Roller applies pressure to tape frame to remove bubbles and help with adhesion.

Product Details

Used MTI NSX 250

Inventory Number: 58912
Now (USD): $21,000.00

Dicing System. Unparalleled machine rigidity, a unique overarm spindle support. Three layers of vibration isolation, Windows™ based CNC controls. For dicing silicon, gallium arsenide, glass, ceramics and other brittle materials. 2 in. air bearing spindle up to 40,000 rpm. 6 in. dia. vacuum chuck. 208V, 3 Ph, 50/60 Hz.

Product Details

Used SAS PACM 250

Inventory Number: 47124
Now (USD): $6,500.00

Hard Material Dicing Saw. Diamond wheel cuts material on a 6 in. dia. vacuum chuck. Digital readout of X and Y axis. Manual control of index. Motorized cut feed. 200/220V, 3 Ph, 60 Hz.

Product Details

Used Ultron UH 130

Inventory Number: 60590
Now (USD): $5,500.00

Die Matrix Expander. Temperature controlled, heated wafer ram. 3-inch stroke with speed control and adjustable stroke stop. Consistent repeatability of expansion. Compact tabletop configuration. Adjustable preheat time. Ultron Systems Model UH 130 Die Matrix Expander increases throughput and yield through gentle die separation. The expander presents the die in an evenly spaced matrix to facilitate retrieval for pick and place or die attach. Streets remain parallel resulting in better die presentation.

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