Cleaning Systems

EDC 100 Exclusive Design Co. Rigid Disk Cleaning System. Uses brushes and surfactant to scrub disks. LCD display. Analog control of scrub/rinse speed and spin dry speed. 115V, 60 Hz.

UVOCS T10X10-OES Ultra Violet Ozone Cleaning System. UV/Ozone cleaning process provides a simple, inexpensive, fast method of obtaining ultra-clean surfaces free of organic contaminants on most inorganic surfaces, such as quartz, silicon, gold, nickel, aluminum, gallium, arsenide, alumina†, etc.  The process is ideal when thin film deposition with excellent adhesion to the substrate is required.  Ultra-clean surfaces can easily be achieved by UV/Ozone processing in one to several minutes after the substrate has been cleaned by conventional techniques. Active Area: 100” squared. Sliding parts tray height to 1.5”. Lamp units 245nm UV. Digital controller. 115V, 60 Hz, 2.5A

UVP PR-100 Ozone Surface Cleaner A photochemical interaction occurs in an atmosphere of ultraviolet radiation and ambient air that generates ozone. As the molecules of an organic contaminant become active under ultraviolet radiation they dissociate. The organic contaminants then decompose into harmless volatile gases such as carbon dioxide. The PR-100 produces surfaces meticulously free of contamination. Chamber: 111/8” x 11 5/8” x 3 1/8”.

Semitool STI 870 Spin Rinser Dryer Double Stack. 6” Wafer Rotor in the top spinner and a 4" Rotor in the bottom spinner. High performance cleaning, rinsing and drying system for 25 wafer batch cassette. This system is capable of cleaning substrates from 2” to 6” round if the correct Rotor is installed for that wafer size. On axis orientation keeps wafers parallel allowing DI water manifolds to spray both sides of product continuously and simultaneously. Built in resistivity monitor. 120V, 50/60 Hz,

Semitool STI ST 260 Spin Rinser Dryer. High performance cleaning, rinsing and drying system for 25 wafer batch cassette. Currently configured with Rotor for 2” wafers. This system is capable of cleaning substrates from 2” to 5” round if the correct Rotor is installed for that wafer size. On axis orientation keeps wafers parallel allowing DI water manifolds to spray both sides of product continuously and simultaneously. Built in resistivity monitor. 120V, 50/60 Hz,

UVOCS T16X16/OES Ultraviolet Ozone Cleaning System. Cleaning or oxidation with the UVOCS is accomplished by the combination of ultraviolet light and ozone.  Low pressure quartz-mercury vapor lamp which generates UV emissions in the 254 and 185 nanometer range.  Source Size: 16” x 16”. Active Area: 256 sq. in. Width: 20”. Depth: 29¾”. Height: 14½ ”. 110 V, 60 Hz, 5.0A

Branson Ultrasonics B950R Automatic Ultrasonic Vapor Degreaser. Branson B950R Ultrasonic Vapor Degreaser is the latest in a series of environmentally sound, cost effective precision degreasers. The B-Series is designed to comply with EPA environmental regulations on solvent emissions, an important environmental and economic consideration.

Branson Ultrasonics B950R Automatic Ultrasonic Vapor Degreaser. Branson B950R Ultrasonic Vapor Degreaser is the latest in a series of environmentally sound, cost effective precision degreasers. The B-Series is designed to comply with EPA environmental regulations on solvent emissions, an important environmental and economic consideration.

• Freeboard ratio of greater than 124% to eliminate diffusion losses
• Refrigerated primary condensing coil to condense the bulk of the solvent vapors
• Refrigerated sub-zero freeboard condenser to provide a cold air barrier minimizing fugitive losses
• Sliding cover to eliminate drafts and help seal the unit during periods of inactivity.
• Offset boiling sump with liquid level control
• Bag filter to minimize solvent loss during maintenance
• Cooled internal water separator to reduce losses
• Stainless plumbing for solvent-wetted areas
• Includes optional Automated hoist system with automated lid.
• 40 Khz Ultrasonics

OnTrak DSS-200 CMP Double Sided Brush Cleaner. Double sided wafer cleaner for post CMP cleaning. The DSS-200 scrubs, rinses and dries 4”, 6” or 8” (100, 150 or 200mm) wafers. System is currently configured for 6" by 6" squares. Parts needed to change sizes. Consists of system electronics, a send indexer, a brush cleaning station, spin station and robotic edge handling receive indexer. Wafers are DI sprayed while in sender, moved to brush stations where they are cleaned by top and bottom brushes with DI and/or cleaning chemistry. In spinning station they are DI rinsed and dried. CE marking.