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Bonders - Welders

Reliability, accuracy and consistency is critical to effective wire bonding and ball bonding, especially in high production environments. Finding or replacing well-made, dependable bonders, welders and associated machinery that you can trust makes all the difference between outputting quality electrical connections and unacceptable failure rates.

At Bid Service, we source, refurbish and supply high-quality wire bonding equipment, including manual wire bonders, automatic wire bonders, parts and spares. We carry a range of equipment from various original manufacturers, including K&S Wire Bonders. All our used wire bonding equipment is thoroughly vetted and tested before we acquire it, and is put through a stringent refurbishment process. We rigorously test, recalibrate and update each piece of equipment as needed to make it like new before selling it on to you.

We endeavour to carry a full and comprehensive range of refurbished wire bonding, ball bonding, lead attach welding, and hot bar soldering systems and more. As refurbishers and distributors of quality second-hand bonders and welders, our range can vary from time to time and we recommend browsing our site regularly, or getting in touch to find out if we’re carrying what you need.

We also buy used bonders and welders, so if you have any used equipment you wish to replace, or if you are moving, closing down a section of your operations, or need to sell a full operation, we will assess your second-hand equipment and make you an offer.

Used Newport LW4200

Inventory Number: 90110
Now (USD): $4,500.00

Newport LW4200 Optoelectronics Laser Welding System. Parts tool only, no electronics with system, just what is in the photos. Alignment fixturing inside laser box on a vibration isolation table.

Product Details

Used Ohashi CAJR-02SDPX

Inventory Number: 60383
Now (USD): $12,000.00

Ohashi CAJR-02SDPX Tabletop Chip Alignment System for LCD or FPC. Aligns and mounts IC chips onto a position of LCD or FPC. Date of Mfg.: 9/2010.

Product Details

Used Ohashi CBMR-02SDPX

Inventory Number: 60406
Now (USD): $6,500.00

Ohashi CBMR-02SDPX Flat Panel Connector Bonder. Controls for bonding time, bonding temperature, marker on, auto or manual mode, head up/down. Year of Mfg.: 2010.

Product Details

Used Optics For Research IO-5-NIR

Inventory Number: 55520
Now (USD): $950.00

Optics for Research IO-5-NIR Broadband Adjustable Optical Isolator.

Product Details

Used Royce DE 35i

Inventory Number: 61750
Now (USD): $15,000.00

Royce DE 35i Semiautomatic Die Handler. The DE35i Semiautomatic die pick and place system is an elegantly simple, low cost machine for picking die from sawn or scribed wafers mounted on adhesive film. Die can be placed into waffle packs, Gel-Paks®, film frame or directly on substrates.

Product Details

Used Royce System 226

Inventory Number: 62775
Now (USD): $4,950.00

Royce System 226 Wire Bond Pull Tester. Wire testing is performed by pulling a high precision hook against a bond wire loop. The front panel LCD display shows the last test result and system status. The pull tester is capable of 100 gram testing force with a 0.1 gram resolution. Performs precision destructive and nondestructive testing. Meets requirements of MIL standard 883. 110-220V, 50/60 Hz, 2/1A.

Product Details

Used Royce 650

Inventory Number: 62325
Now (USD): $15,000.00

Royce 650 Universal Bond Tester. The Royce 650 Universal Bond Tester offers the most robust selection of capabilities in the Royce bond tester family, from the full range of standard test applications through custom testing. This high-end instrument is versatile and powerful enough to meet your complete bond testing needs. The Royce 650 features a wide range of applications. One-button microscope height adjustment. Large stage travel. With an X-axis travel over 300 mm and a Y-axis travel over 150 mm of the servo driven XY stage, the Royce 650 easily accommodates up to 300 mm wafers and substrates, lead frames and large electronic modules. Interchangeable test modules and tooling. Most test modules and tooling are quickly interchangeable between the Royce 650 and Royce 620. All test modules have four software selectable subranges down to 1/10 of full scale to maximize the versatility of the instrument. Space saving, easy to access integrated PC. Ultrafine Pitch. The high-accuracy shear height and sub-micron resolution of the XY stage deliver solid positioning repeatability for ultrafine pitch testing. Unit comes with one load cell, $2,500 each for additional load cells. Load Cells available: Die Shear SMS-20K-21860, ranges 20 Kg, 10 Kg, 5 Kg, 2 Kg. Tweezer Pull SMG-1K-21854, ranges 1 Kg, 500 g, 200 g, 100 g. Unit has missing stage lead screw.

Product Details

Used Royce A45

Inventory Number: 61160
Now (USD): $19,500.00

Royce A45 Automatic Die Handling Pick and Place System. For picking die from diced wafers and transferring them to carriers. Can pick and place die from wafer up to 8 in. dia. PC controller. 110-240V, 50/60 Hz, 2A.

Product Details

Used Scientific Sealing Technology HV-2200-GT

Inventory Number: 60151
Now (USD): $25,000.00

Scientific Sealing Technology HV-2200-GT High Vacuum Thermal DAP Package Sealer. The HI VAC-2200 GT system is used for soldering, brazing or glass sealing of components requiring low residual gas environment or low moisture content. The system also has the capability of providing for a high vacuum, in-process bake for the removal of contaminating volatiles prior to backfilling with the controlled atmospheres of your choice. 220V, 1 Ph, 50/60 Hz, 100A. Typical Applications: Package sealing requiring controlled internal environment. Void free, flux free soldering for die attach, MCM assembly, power components and flip chip attach. Glass fusion and glass to metal sealing. Field emission flat panel display assembly. Glass to silicon, silicon to silicon wafer bonding. System Features: User friendly menu driven programming. Precise control of temperature (up to 1000 deg C), heating rates, dwell times and cooling rates.

Product Details

Used Semiconductor Equipment Corp. 410

Inventory Number: 52745
Now (USD): $29,000.00

Semiconductor Equipment Corp. 410 Flip Chip Die Bonder. Aligns and attaches flip chip die onto various substrates. Versatile processing capabilities allow for tacking die in place for subsequent reflow or for complete attachment on the heated work stage. Comes with only one die tray holder. Motorized Stage Travel: 6 in. Computer controlled 350 deg C heated stage. Cube beam splitter alignment. Die Size: 0.010 to 1.000 in. sq.

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