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Inventory Number: 61486
Category: Glove Boxes - Seam Cap - Welders
Manufacturer: Karl Suss

Precision High Performance Mask Aligner. Mask aligner with vacuum contact, proximity or soft contact modes. System capable of exposing partial wafers or substrates up to 3 in. dia. Split field optics for faster easier alignment with trinocular head for camera port. 5X, 10X,20X objective lenses. Fiber optic microscope illuminator. CIC 500 digital power supply. 350W lamp housing operates in the 365 to 400nm spectral range. High precision X,Y, Theta alignment stage. 110V, 60 Hz.

Now (USD): $32,500.00

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Used Karl Suss MJB3-IR

Inventory Number: 51506
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THIS UNIT IS SOLD. WE WOULD LIKE TO BUY YOUR KARL SUSS SYSTEMS. PLEASE CONTACT US IF YOU HAVE SYSTEMS TO SELL. * * * * * * * * * * * * * * * * * * * * * * * * * * Mask Aligner with Backside and Topside Alignment Capabilities. The scanning backside alignment is accomplished using an IR camera which detects infrared light transmitted through an IR transparent chuck, as well as the substrate and mask being aligned. The alignment microscope uses 5X, 10X and 20X objective lenses for either backside or topside alignment. For topside alignment the eyepieces are 12.5X. The exposure source is a 350W Hg lamp powered by a Suss Model 505 supply. The system incorporates UV-400 optics to transfer the energy to the substrate. The substrate may be exposed in soft or hard contact with both forms of alignment. Also in topside alignment the vacuum contact (high precision “HP”) is available.

Product Details

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Inventory Number: 59511
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Standard Mask Aligner. System capable of exposing partial wafers or substrates up to a maximum size of 3 in. dia. Ask salesperson about available chucks and sizes. Hard or soft contact modes. 365nm to 400nm spectrum of a 200W high pressure arc lamp. Alignment optics consist of normal field microscope with objective turret for different magnifications. 110V, 60 Hz. mjb, mjb3.

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Inventory Number: 59550
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Mask Aligner with Backside and Topside Alignment Capabilities. The scanning backside alignment is accomplished using an IR camera which detects infrared light transmitted through an IR transparent chuck, as well as the substrate and mask being aligned. Olympus microscope. The alignment microscope uses 5X, 10X, 20X and 50X objective lenses for either backside or topside alignment. For topside alignment the eyepieces are 10X. The exposure source is a 350W Hg lamp powered by a Suss Model CIC 500. The system incorporates UV-400 optics to transfer the energy to the substrate. The substrate may be exposed in soft or hard contact with both forms of alignment. Also in topside alignment the vacuum contact (high precision“HP”) is available. Wavelength: 365nm, 405nm. 115-230V, 50/60 Hz. Very Nice Condition.

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Research Grade Mask Aligner and Exposure System. System capable of exposing partial substrates or complete wafers. Microscope with three objectives. 365nm to 400nm spectral range up to 350W. Has 2 in. chuck currently installed, others available at added price. Older unit but will be fully tested and all worn out parts replaced. 110V, 60 Hz.

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Mask Aligner with IR Transmission Alignment for Front or Backside Alignment. Microscope with long working distance objectives. IR transmission alignment system applicable to materials transparent to wavelengths in the range from 400 to 2000nm. The backside alignment is accomplished using an IR camera which detects infrared light transmitted through an IR transparent chuck, as well as the substrate and mask being aligned. The substrate can be exposed in soft or hard contact with both forms of alignment. Also in topside alignment the vacuum contact (high precision HP) is available. 110V, 60 Hz.

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Precision High Performance Mask Alignment and Exposure System. Easy to use manual mask aligner. System capable of exposing partial wafers or substrates up to a maximum size of 3 in. dia. (Ask a salesperson about available mask and chuck sizes). Hard or soft contact modes. High precision alignment stage X,Y, Theta. 365 to 400nm spectral range up to 350W. 110V, 60 Hz.

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