Bid Service, LLC 225 Willow Brook Rd. Freehold, NJ 07728
Phone: 732-863-9500 Fax: 732-863-1255
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Factory Interface Load Station. Front end load station for Applied Materials Endura or Centura platforms. 300mm FOUP interface.
Oxide Process Module for Nano-ALD System. Process module only, no pumps. 300mm. Sold not tested with 30 day right to return.
Brooks Automation Gemini Express Vacuum Cluster Tool Integration Platform. No vacuum pumps included. Removed from service, nice condition. Sold not tested with 30 day right to return.
Process Module for Nano-ALD System. Process module only, no pumps. 300mm. Sold not tested with 30 day right to return.
Silicon Nitride PECVD System. Plasma Enhanced Chemical Vapor Deposition system. The system uses gases (primarily silane and ammonia) to deposit thin layers of silicon nitride used in anti-reflective coating in solar industry. Using plasma excitation this is possible at low temperatures of 300-500 deg C. The system is constructed to be an R&D tool so it allows all kinds of thin film depositions (depending on gases used as sources). Process Area: 400mm x 450mm. Deposition Rates: Up to 500nm/min for Si-based films. Mfg.:2008. $69,000 AS IS. $99,000 Fully Tested.
ICP Plasma Etch System. Inductively coupled plasma etching system for high etch rates and control over selectivity and damage. PC controller with graphical user interface. 9.5 in. bottom electrode, ceramic clamp currently for 2 in. wafer. Chamber pumped via turbo pump with rough pump. RF Generators: RFPP5S 500W, 13.56 MHz and RFPP10M 1000W, 2 MHz. Six MFC mass flow gas controllers. Previous Gases used: CL2, SF6, N2, CF4, AR, BCL3. AS IS Price: $99,000. Refurbished: $125,000.
300mm CVD Chemical Vapor Deposition Chamber. Was installed on a Centura System. MKS Astex Astron 2L remote plasma source. First Dep. Manifold: AR - Pump Purge. AR - 3.0 SLM. SIH4 - 2.0 SLM. DCS - 1.0 SLM. Second Dep. Manifold: WF6 - 20 sccm. AR - 3.0 SLM. AR - Pump Purge. Clean Manifold: NF3 - 1.0 SLM. AR - 3.0 SLM. AR - Pump Purge. Bottom Purge Manifold: AR - 3.0 SLM. Heater Purge Manifold: N2 Heater Purge.
Large Capacity Open Loaded Plasma Enhanced Chemical Vapor Deposition System. A 460mm diameter electrode offers a capacity of up to twelve 4 in. wafers. Ideally suited for batch PECVD processing where excellent across chamber uniformity of less than 2 percent is achieved for silicon nitride and silicon dioxide layers. Last owner had set up for 2 in. wafers. 18.75 in. top electrode with shower head gas input. Footprint is kept to a minimum by locating all electronics and vacuum components within the body of the tool, mass flow controllers are housed separately in a wall mounted gas pod. Six MFC gas controllers, previously used gases He, N2, N2O, NH3, SIH4/N2, CF4. PC controller provides intuitive user interaction with the system via advanced graphics and process recipe pages. Includes vacuum pump and blower package. Mfg. 2009, nice condition.
Stainless Steel Bubbler Heatexchanger.
Stainless Steel Bubbler Heat Exchanger.
Centura 300mm CVD Chamber. MKS Astex Astron 2L remote plasma source. Main Dep Manifold: N2 - Pump Purge. N2 - 20.0 SLM. H2 - 10.0 SLM. 1 percent PH3 in 99 percent. H2 - 100 sccm. SIH4 - 500 sccm. Clean Manifold: NF3 - 1.0 SLM. AR - 6 SLM. N2 - Pump Purge. Bottom Purge Manifold: N2 - 20 SLM. N2 - Heater Purge.
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