Bid Service, LLC 225 Willow Brook Rd. Freehold, NJ 07728
Phone: 732-863-9500 Fax: 732-863-1255
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Automated Defect Inspection System. Inspection of whole wafers, sawn wafers, JEDEC trays, Auer boats, die in gel/waffle paks, MCM’s. Detects defects down to 0.5 micron. Automated wafer mapping and identification. Automated data collection and reporting. Menu-based, easy to use Windows environment. 200-240V, 1 Ph, 50/60 Hz, 5A, CE.
Non-Contact Profile Measurement System. Uses laser triangulation to analyze two dimensional data. Non-contact measurement allows you to work with wet and fragile samples. PC controller analyzes data. Motorized stage. 120V, 60 Hz.
Three-Dimensional Video Coordinate Measuring System. Automatically analyzes video images of objects for dimensional measurements. The IQ then takes those measurements and compares them to nominal values and tolerances to identify conditions of non-conformance. Includes 4 basic subsystems: Mechanical Motion System. Imaging System: Consisting of the image forming optics, illumination devices, and the image sensing video camera. Image Processing system: The feature extraction, identification, and measurement capabilities. Operator Workstation: Computer and input devices where all programming operations are executed and where measurement results and machine status are displayed. Sold As Is.
Film Thickness Mapping System. Fully automated system produces highly accurate, precise, and stable measurements of film thickness, reflectivity, and refractive index on monitor and patterned wafers. Windows® based software with Stattrax® Statistical Tracking Software.
Bump Measurement Profiling System. The right inspection tool for flip-chip process control. Repeatably measures solder bump heights, from 150 micro-meters or more for standard flip-chip bumps down to a few microns for under-bump metalization pads, as well as provides volume data on all bump sizes. Non-contact 3-D data on all size bumps over the entire wafer. The system calculates bump height, width, volume and coplanarity. Automatically detects bump position, solder bridges, and missing and extra solder bumps, with prominent display of pass/fail results and position statistics at the bump, die,wafer and lot level. Powerful measurement analysis, generating output as 2-D cross sections, contour plots, bearing ratio plots, or 3-D images. A built in Wizard allows quick measurement set-up.
Advanced In-Line Defect Inspection System. Automated full wafer inspection system for detecting particles as small as 0.10 micro-meters on bare silicon and patterned process wafers. High detection sensitivity even for difficult after-etch, develop, and chemical mechanical polishing. High throughput of up to 30 full wafer scans per hour on 200mm wafers.
Multimode Scanning Probe Microscope. The Magnascope SXM300 is a multimode probe microscope that measures sub-micron features to near angstrom-level resolution. It is designed for critical-dimension measurements of height, width, roughness and sidewall angles of 300mm wafers and masks of up to 9 in x 9 in. Sold As Is.
Photoluminescence Mapping Tool. For process control, analysis of band-gap, ternary layer composition, layer thickness and crystal perfection.
Prism Coupler. For measurement of thin film thickness and refractive index.
High Performance Non-Contact Metrology System. Fully automatic. Windows® operating system. Easy to program and use. Powerful view metrology software. Measuring Range: 300 x 300 x 150mm. 115V, 50/60 Hz, 15A.
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