Automated Defect Inspection System. Inspection of whole wafers, sawn wafers, JEDEC trays, Auer boats, die in gel/waffle paks, MCM’s. Detects defects down to 0.5 micron. Automated wafer mapping and identification. Automated data collection and reporting. Menu-based, easy to use Windows environment. 200-240V, 1 Ph, 50/60 Hz, 5A, CE.