New Arrivals

VWR 1177PD Refrigerated Recirculating Chiller. Temperature Range -10°C to +40°C. Digital setpoint controller. Cooling capacity 2300W @ 20°C, 1550W @ 10°C, 875W @ 0°C. Positive displacement pump capacity 13.2 L/min. (3.5 GPM) 230V, 60Hz, 11.9A

West Bond 7700E-79 Thermosonic Ball to Wedge Wire Bonder. Wire Bonder Bonds gold wires ranging from 0.0007” to 0.002”. Three-axis manual micromanipulator, entire mechanism arrayed above the work plane, so there is no limit to size of work piece. All machine configuration constants and bond settings are programmable, prompted by a series of screens. Heated work holder with digital control. 115V, 50/60 Hz, 10A

WEST BOND 747677E-79C Combination Bonder capable of Ball Bonding and Wedge Bonding. Bonder comes with two bond heads, one wedge and one ball bond. Easy and quick change over. Three-axis micromanipulator with entire mechanism above the work plane, no limit to the size of a work piece. Heated stage with digital  controller. Machine configuration constants and bond settings are programmable. 110V, 50/60Hz, 2A

YIELD YES 310 Dual Function Image Reversal or HMDS Vapor Prime Oven. Capacity for HMDS Prime: 8 cassettes of 4” wafers, or 1 cassette of 5-8” wafers. Capacity for Image Reversal: 4 cassettes of 4” wafers, or 1 cassette of 5-8” wafers. Cleanliness: <10x1 micron particles per 4” wafer. Throughput for HMDS Prime: 2 full loads/hr. Throughput for Image Reversal: (2) ½ loads/hr. Temperature: 250°C maximum. Does not include a vacuum pump at this price.