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Wafer Analysis

Used Rudolph Auto El III

Inventory Number: 61169
Now (USD): $4,950.00

Ellipsometer. Displays film thickness, index, order thickness, substrate N and K. Internal data reduction software for single and double layer transparent films. 115V, 50/60 Hz.

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Used SSEC M3302

Inventory Number: 60584
Now (USD): $125,000.00

Single Wafer Chemical Etch Processor. • Currently configured for 8 in./200mm. • Mfg. Date: 2013. • Model M3302 - (2) process modules. • Install Type: Through-the-wall (TTW). • CE Marked. • Dry-In / Dry Out Operation. • Factory Interface with mini-environment. • (4) 8 in. (200mm) Cassette Stations. • Automatic Load/Unload. Note: Cassette station No. 3 dedicated to Cu. • Wafer Aligner. • (4) End-effecter Wafer Handling Robot. • Application: BEOL. • Process Module-1: Non-Cu (General Purpose). • Process Module-2: Cu dedicated. • SECS/GEM Interface. • Safety: INTLK/Comm.: H2SO4/H2O2. • INTLK/Comm.: HF. • Facility Requirements: CDA, N2, DIW, HF (10:1), Sulfuric (97 percent), Hydrogen Peroxide (30 percent). • Power: 208VAC, 20A, Single Phase, 60Hz. • Was operational when deinstalled.

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Used Sun International Sopra GESP-5

Inventory Number: 58885
Now (USD): $21,500.00

Variable Angle Broadband Spectroscopic Ellipsometer. Ellipsometer for complicated film stacks, mapping film thickness and optical properties. Has PMT detector. Wavelength: 250nm to 850nm. User friendly Windows® based interface. SOPRA ellipsometer that had been serviced by Angstrom Sun Technologies. Allows for variable angle broadband spectroscopic ellipsometry. Motorized 8 in. stage for 3D sample plots. Camera with zoom lens.

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Used Tencor SURFSCAN AIT Model 8010

Inventory Number: 40884
Now (USD): $29,000.00

Advanced In-Line Defect Inspection System. Automated full wafer inspection system for detecting particles as small as 0.10 micro-meters on bare silicon and patterned process wafers. High detection sensitivity even for difficult after-etch, develop, and chemical mechanical polishing. High throughput of up to 30 full wafer scans per hour on 200mm wafers.

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Used Tencor FLX 5200h

Inventory Number: 48127
Now (USD): Contact for Price

THIS UNIT IS SOLD. WE WOULD LIKE TO BUY YOUR TENCOR SYSTEMS. PLEASE CONTACT US IF YOU HAVE SYSTEMS TO SELL. * * * * * * * * * * * * * * * * * * * * * * * * * * Automated Thin Film Stress Measurement System. Features patented dual wavelength technology which allows production monitoring of critical reliability problems caused by metal and dielectric film cracking, voiding,lifting and hillock formation. Data analysis features wafer topography measurement along diameter, trend plotting, calculation of water diffusion coefficient,automatic recalculation of stress when film or substrate thickness is corrected, and linear regression and calculation of stress-time gradients.

Product Details

Used Tencor P10

Inventory Number: 59853
Now (USD): $22,500.00

High Precision Surface Profiler. Provides surface topography measurements on a wide variety of substrates. Can quickly characterize step heights, roughness and waviness. Two-dimensional traces displays provide additional information that is important in understanding the surface. Scan Length: 20mm. 115V, 60 Hz, 4A.

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Used Tencor P20H

Inventory Number: 38497
Now (USD): $39,000.00


Long Scan Profiler. Measurement of vertical features ranging from under 100 angstroms to approximately 0.3mm, with a vertical resolution of 1 or 25 angstroms. Ability to fit and level data, allowing accurate measurements on curved surfaces. Handles wafers from 3 to 8 in., but currently configured for 6 in. or 8 in. wafers. Full 8 in. scanning. Can scan up to 25 wafers without operator intervention.

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Used Tencor FLX 2908

Inventory Number: 61745
Now (USD): Contact for Price

Thin Film Stress Measurement System. More information to come contact us for details.

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Used Tencor AS 200

Inventory Number: 61746
Now (USD): Contact for Price

Profiler. More information to come contact us for details.

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Used Tencor FLX 2320

Inventory Number: 61825
Now (USD): $19,500.00

Thin Film Stress Measurement System. The Tencor FLX 2320 uses laser scanning technology to provide accurate measurement of thin film stress on all types of films and substrates. Stress can be monitored at temperatures to 500 deg C allowing better understanding of film properties both during processing and in the environment where the completed integrated circuit operates. Allows production monitoring of conditions which lead to critical reliability problems such as metal film and dielectric cracking, voiding, lifting and hillock formation. Flexible, menu-driven analysis software is easily learned and used by production operators. Any combination stress, bow, temperature, time or reflected light intensity measurements can be displayed. Older system but sold fully tested and in good working order.

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