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Plasma Etchers - Ashers - Ion Mills

Used Tegal 900E

Inventory Number: 33748
Now (USD): $3,950.00

Cassette to Cassette Photoresist Strip/Backside Etching. Spatula wafer transport from cassette to cassette. Users are guided through programming and operation by menu-driven software and soft-keys via a built in display and an external terminal. System is currently configured for 4 in. wafers. Sold As Is.

Product Details

Used Tegal 801

Inventory Number: 36278
Now (USD): $750.00

Inline Plasma Etcher. Fully automatic, microprocessor-based, plasma chemistry etcher designed especially for the etching of thin films deposited on semiconductor wafers. All gas flow rates controlled by mass flow controllers. Sold As Is. Does not come with monitor or RF generator.

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Used Tegal 803

Inventory Number: 36279
Now (USD): $750.00

Inline Automatic Plasma Etcher. The Plasma Inline 803 is a fully automatic, microprocessor-based plasma chemistry etcher designed especially for the etching of silicon dioxide (Si02) thin film deposited on single crystal or polysilicon semiconductor wafers. It provides up to four process gases, two process channels and a clean channel. Sold As Is. Does not come with monitor or RF generator.

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Used Trion MINILOCK

Inventory Number: 56453
Now (USD): $9,500.00

Single Wafer RIE Etcher. LCD display. Load lock with transfer arm. Current substrate carrier for up to 150mm wafers. Five MFC for gas input. Missing RF generator and vacuum pump. Sold As Is.

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Used Trion Technology PHANTOM II

Inventory Number: 57573
Now (USD): $59,000.00

ICP Inductively Coupled Plasma Etch System. For applications requiring a downstream, high density plasma source. Allows for higher plasma densities at lower pressures. Tight anisotropy in high aspect ratio structures and reduces microloading effect. Four MFC gas inputs mounted in seperate cabinet. System has turbo pump and roughing pump. Two RFX-600 13.56 MHz RF generators. 200mm substrate chuck.

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Used Ulvac Phoenix Enviro I

Inventory Number: 60465
Now (USD): $35,000.00

Single Chamber Multiple Step RF & Microwave Plasma Asher. Production proven resist strip and residue cleaning solution. 120/208V, 3 Ph, 50/60 Hz, 42A. Came out of working environment but did not see it running. Can be set up and fully tested at additional cost. Sold As Is.

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Used Xactix X2C

Inventory Number: 61744
Now (USD): $39,000.00

Xenon Difluoride Etching System. Isotropic etching of silicon using xenon difluoride is an ideal solution for releasing MEMS devices. XeF2 shows nearly infinite selectivity to silicon over almost all standard semiconductor materials including photoresist, silicon dioxide, silicon nitride and aluminum. Being a vapor phase etchant, XeF2 avoids many of the problems typically associated with wet or plasma etch processes. Etches Silicon, Molybdenum and Germanium. High selectivity to many materials including: SiO2, Si3N4, most metals, dielectrics, polymers. Long undercuts are possible (> 100 micrometers). No stiction associated with wet etching. Doesn’t quickly attack BOSCH process passivation layer.

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