Dicing Saws-Scribers

Aremco Accu-Cut 5200 Ultra Hard Material Dicing Saw. Used to cut a wide range of ultra-hard materials such as ceramics, ferrites and quartz, as well as semiconductor materials including silicon, gallium arsenide and bismuth telluride. The Accu-Cut Model 5200 is a compact, semiautomatic system for laboratory and production applications on substrates up to 4 in. x 4 in. x 3/4 in. thick. It comes equipped with a 5,000 rpm fixed speed spindle, a manual indexing Y-stage and an air/oil in-feed for maintaining smooth, precise stage control. Parts are mounted with a pneumatic vise or vacuum manifold to a 360° theta stage for part alignment, and a monocular microscope.

Ultron UH115 Semiautomatic Wafer Frame Film Mounter. The Model UH115 features a semiautomatic one-pass lamination which provides an extra margin of safety when mounting particularly fragile wafers/substrates. Bubble free film lamination. Static Ionization Bar with power safety interlock. Does not come with Take-up roller assembly option. Edge-Contact Workstage for 6" wafers. 115V, 1PH, 50/60Hz, 3A

K&S 961 Wafer Tape Frame Mounter. The K&S Model 961 Wafer Mounting Station enables the mounting of wafers up to 6 inches in diameter. This mounting station is compatible with standard or interleaved UV-curable tape, and contains a vacuum stage wafer hold-down for holding the wafer in position during mounting. A programmable heating stage heats the tape to attain uniform tensioning, the adjustable spring loaded plate ensures optimal contact pressure and a built-in tape cutter facilitates mounted piece extraction. Includes optional static eliminator and tape backing removal assembly. 110V, 50/60Hz, 5A. HERE IS A LINK TO A VIDEO DEMONSTRATION OF THIS TOOL WORKING 

https://youtu.be/AST4UKs81MY

Scifab Series 1000 Deluxe Hard Tissue Microtome.