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Bonders - Welders

Reliability, accuracy and consistency is critical to effective wire bonding and ball bonding, especially in high production environments. Finding or replacing well-made, dependable bonders, welders and associated machinery that you can trust makes all the difference between outputting quality electrical connections and unacceptable failure rates.

At Bid Service, we source, refurbish and supply high-quality wire bonding equipment, including manual wire bonders, automatic wire bonders, parts and spares. We carry a range of equipment from various original manufacturers, including K&S Wire Bonders. All our used wire bonding equipment is thoroughly vetted and tested before we acquire it, and is put through a stringent refurbishment process. We rigorously test, recalibrate and update each piece of equipment as needed to make it like new before selling it on to you.

We endeavour to carry a full and comprehensive range of refurbished wire bonding, ball bonding, lead attach welding, and hot bar soldering systems and more. As refurbishers and distributors of quality second-hand bonders and welders, our range can vary from time to time and we recommend browsing our site regularly, or getting in touch to find out if we’re carrying what you need.

We also buy used bonders and welders, so if you have any used equipment you wish to replace, or if you are moving, closing down a section of your operations, or need to sell a full operation, we will assess your second-hand equipment and make you an offer.

Used Scientific Sealing Technology HV-2200-GT

Inventory Number: 60151
Now (USD): $32,500.00

High Vacuum Thermal DAP Package Sealer. The HI VAC-2200 GT system is used for soldering, brazing or glass sealing of components requiring low residual gas environment or low moisture content. The system also has the capability of providing for a high vacuum, in-process bake for the removal of contaminating volatiles prior to backfilling with the controlled atmospheres of your choice. 220V, 1 Ph, 50/60 Hz, 100A.

Typical Applications: Package sealing requiring controlled internal environment. Void free, flux free soldering for die attach, MCM assembly, power components and flip chip attach. Glass fusion and glass to metal sealing. Field emission flat panel display assembly. Glass to silicon, silicon to silicon wafer bonding.

System Features: User friendly menu driven programming. Precise control of temperature (up to 1000 deg C), heating rates, dwell times and cooling rates.

Product Details

Used Semiconductor Equipment Corp. 410

Inventory Number: 52745
Now (USD): $29,000.00

Flip Chip Die Bonder. Aligns and attaches flip chip die onto various substrates. Versatile processing capabilities allow for tacking die in place for subsequent reflow or for complete attachment on the heated work stage. Comes with only one die tray holder. Motorized Stage Travel: 6 in. Computer controlled 350 deg C heated stage. Cube beam splitter alignment. Die Size: 0.010 to 1.000 in. sq.

Product Details

Used Semiconductor Equipment Corp. 410X

Inventory Number: 52615
Now (USD): $25,000.00

Flip Chip Die Bonder. Aligns and attaches flip chip die onto various substrates. Granite table with granite risers. Alignment accuracy is +/-5 microns. PC controller.

Product Details

Used Semiconductor Equipment Corp. 410

Inventory Number: 57636
Now (USD): $29,000.00

Flip Chip Die Bonder. Aligns and attaches flip chip die onto various substrates. Versatile processing capabilities allow for tacking die in place for subsequent reflow or for complete attachment on the heated work stage. Comes with only one die tray holder. Motorized Stage Travel: 6 in. Computer controlled 350 deg C heated stage. Cube beam splitter alignment. Die Size:
0.010 in. sq. to 1.000 in. sq.

Product Details

Used Toddco General PRO-65

Inventory Number: 61444
Now (USD): $3,950.00

Hot Bar Bonding System. System used in solder reflow and heat seal bonding. 230V, 1 Ph, 50/60 Hz, 6A.

Product Details

Used West Bond 7327C-81

Inventory Number: 62000
Now (USD): $4,950.00

Manual Die Bonder. Model 7327C offers up to 6 different die collets on a pneumatically operated turret mechanism for complex packages with a variety of die sizes. Desired collets are advanced into position by operator activated push button switch on micromanipulator ball. Six sets of values for length, number of cycles, direction, and velocity of scrub strokes are entered into buffers associated with the turret tool positions, as to execute a scrub motion program appropriate to each die collet tool. Radiant tool heat is not available with the 7327C. Does not come with work holder.

Product Details