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Bonders - Welders

Reliability, accuracy and consistency is critical to effective wire bonding and ball bonding, especially in high production environments. Finding or replacing well-made, dependable bonders, welders and associated machinery that you can trust makes all the difference between outputting quality electrical connections and unacceptable failure rates.

At Bid Service, we source, refurbish and supply high-quality wire bonding equipment, including manual wire bonders, automatic wire bonders, parts and spares. We carry a range of equipment from various original manufacturers, including K&S Wire Bonders. All our used wire bonding equipment is thoroughly vetted and tested before we acquire it, and is put through a stringent refurbishment process. We rigorously test, recalibrate and update each piece of equipment as needed to make it like new before selling it on to you.

We endeavour to carry a full and comprehensive range of refurbished wire bonding, ball bonding, lead attach welding, and hot bar soldering systems and more. As refurbishers and distributors of quality second-hand bonders and welders, our range can vary from time to time and we recommend browsing our site regularly, or getting in touch to find out if we’re carrying what you need.

We also buy used bonders and welders, so if you have any used equipment you wish to replace, or if you are moving, closing down a section of your operations, or need to sell a full operation, we will assess your second-hand equipment and make you an offer.

Used Royce System A45

Inventory Number: 61160
Now (USD): $19,500.00

Automatic Die Handling Pick and Place System. For picking die from diced wafers and transferring them to carriers. Can pick and place die from wafer up to 8 in. dia. PC controller. 110-240V, 50/60 Hz, 2A.

Product Details

Used Royce DE 35i

Inventory Number: 61750
Now (USD): $15,000.00

Semiautomatic Die Handler. The DE35i Semiautomatic die pick and place system is an elegantly simple, low cost machine for picking die from sawn or scribed wafers mounted on adhesive film. Die can be placed into waffle packs, Gel-Paks®, film frame or directly on substrates.

Product Details

Used Scientific Sealing Technology HV-2200-GT

Inventory Number: 60151
Now (USD): $32,500.00

High Vacuum Thermal DAP Package Sealer. The HI VAC-2200 GT system is used for soldering, brazing or glass sealing of components requiring low residual gas environment or low moisture content. The system also has the capability of providing for a high vacuum, in-process bake for the removal of contaminating volatiles prior to backfilling with the controlled atmospheres of your choice. 220V, 1 Ph, 50/60 Hz, 100A.

Typical Applications: Package sealing requiring controlled internal environment. Void free, flux free soldering for die attach, MCM assembly, power components and flip chip attach. Glass fusion and glass to metal sealing. Field emission flat panel display assembly. Glass to silicon, silicon to silicon wafer bonding.

System Features: User friendly menu driven programming. Precise control of temperature (up to 1000 deg C), heating rates, dwell times and cooling rates.

Product Details

Used Semiconductor Equipment Corp. 410

Inventory Number: 52745
Now (USD): $29,000.00

Flip Chip Die Bonder. Aligns and attaches flip chip die onto various substrates. Versatile processing capabilities allow for tacking die in place for subsequent reflow or for complete attachment on the heated work stage. Comes with only one die tray holder. Motorized Stage Travel: 6 in. Computer controlled 350 deg C heated stage. Cube beam splitter alignment. Die Size: 0.010 to 1.000 in. sq.

Product Details

Used Semiconductor Equipment Corp. 410X

Inventory Number: 52615
Now (USD): $25,000.00

Flip Chip Die Bonder. Aligns and attaches flip chip die onto various substrates. Granite table with granite risers. Alignment accuracy is +/-5 microns. PC controller.

Product Details

Used Semiconductor Equipment Corp. 410

Inventory Number: 57636
Now (USD): $29,000.00

Flip Chip Die Bonder. Aligns and attaches flip chip die onto various substrates. Versatile processing capabilities allow for tacking die in place for subsequent reflow or for complete attachment on the heated work stage. Comes with only one die tray holder. Motorized Stage Travel: 6 in. Computer controlled 350 deg C heated stage. Cube beam splitter alignment. Die Size:
0.010 in. sq. to 1.000 in. sq.

Product Details

Used Toddco General PRO-65

Inventory Number: 61444
Now (USD): $3,950.00

Hot Bar Bonding System. System used in solder reflow and heat seal bonding. 230V, 1 Ph, 50/60 Hz, 6A.

Product Details

Used Unitek Micropull III

Inventory Number: 61106
Now (USD): $2,500.00

Manual Wire Bond Pull Tester. Designed to perform wire bond pull test in the .9 to 99.9 gf range. Performs destructive or nondestructive. A digital readout displays data in increments of tenths of a gram force. 115V, 50/60 Hz, 7.5A.

Product Details